2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3d-Peim) 2023
DOI: 10.1109/3d-peim55914.2023.10052206
|View full text |Cite
|
Sign up to set email alerts
|

Inverter/converter power density and flexibility improvements through modularity and novel thermal management architecture

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 4 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?