Introduction to printed circuit board failures

Slee, Daren; Stepan, Jeremiah; Wei, Wei; Swart, Jan

doi:10.1109/pses.2009.5356012

Cited by 15 publications

(2 citation statements)

References 1 publication

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“…Однако существует проблема вариативности переключений, которые приводят к различию характеристик резервируемых и резервных цепей. Также имеет место деградация электрических цепей, которые могут обладать неодинаковыми наборами электрических параметров [5]. Следствием этого является неконтролируемое качество обеспечения МР.…”

Section: томский государственный университет систем управления и ради...unclassified

Research of Modal Redundancy Methods in Common and Differential Modes

Lakoza,

Kosteletskii,

Zabolotsky

2023

Materials of the 26th All-Russian Youth Scientific Conference

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Dependences of the insertion attenuation in two variants of conductor arrangement with modal redundancy (MR) before and after switching are presented. MR var. 1 implies unequal electrical characteristics. MR var. 2 implies that the electrical characteristics of this structure before and after switching are the equal. The application of MR var. 1 is useful, when predicting the degradation of channels as a result of aging of components or their wear, it is possible to identify in advance the tendency of deviation of its characteristics in common and differential modes. MR var. 2 is necessary to ensure the identity of redundant channels before and after switching.

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Section: томский государственный университет систем управления и ради...unclassified

Research of Modal Redundancy Methods in Common and Differential Modes

Lakoza,

Kosteletskii,

Zabolotsky

2023

Materials of the 26th All-Russian Youth Scientific Conference

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“…For instance, overheating can lead to a PCB failure, high degree malfunction, or short circuit, in particular. 1,2 The conundrum of electronic device failure due to the intense heat generation calls for urgency to fabricate efficient thermal interface materials, which can dissipate the thermal energies at a rapid pace. Therefore, with the ever-growing development in the electronic industry, especially in cellular devices, tablets, and computers, it is highly critical and fundamental to develop substrates that provide the benefits of high thermal conductivity as well as reduced thickness to ensure enhanced thermal performances, lifetime, and reliability.…”

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confidence: 99%

Review—Recent Advances in Thermally Conductive Paper-Like Films

Owais

Javed

Akram³

et al. 2021

ECS J. Solid State Sci. Technol.

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Polymer nanocomposites have been extensively used in the electronic industry as thermal interface materials (TIMs) and thermal management materials owing to their sought-after properties related to thermal conductivity and electrical insulation. Typical TIMs include thermal pads and grease; however, thermal papers/films are rapidly getting popular for their remarkable properties like mechanical strength and extraordinary thermal conductivity (TC). Papery films with merits, including simple processing reduced optimized thickness, and enhanced flexibility, are emerging as a new class of materials for thermal management applications in electronics. Thus, even higher loading concentrations of thermally conductive fillers, as high as 95 wt.%, could achieve a tremendous TC with practically no deterioration in the mechanical integrity of composite films, something that was previously known to be a major problem in conventional polymer nanocomposites. In this review, we shall highlight and discuss the latest progress in thermally conductive papers/tapes/thin films and their possible impact on the next-generation electronic components relying on advanced nanotechnologies, and, discuss how these advancements have helped resolving the setbacks related to conventional thermal interface materials, thereby making the thermally conductive thin films/papers a viable solution for future microelectronics.

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