1986
DOI: 10.2307/2930838
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“…sputter followed by data acquisition) was used in all Auger profiles to minimize sample charging and Auger emission interferences. The etch rate of a Ta 2 O 5 /Ta reference under these conditions is ¾1.1 nm min 1 . 15 In the absence of published data on the etch rate of SnO 2 we have taken it to be similar to Ta 2 O 5 .…”
Section: Methodsmentioning
confidence: 99%
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“…sputter followed by data acquisition) was used in all Auger profiles to minimize sample charging and Auger emission interferences. The etch rate of a Ta 2 O 5 /Ta reference under these conditions is ¾1.1 nm min 1 . 15 In the absence of published data on the etch rate of SnO 2 we have taken it to be similar to Ta 2 O 5 .…”
Section: Methodsmentioning
confidence: 99%
“…1 The most common surface treatment method in the bottle industry is to coat the surface of glass bottles with a tin oxide film, followed by coating with a polymer material such as polyethylene. 2 -5 The tin oxide film, commonly called the 'hot-end' coating, is generally vapor deposited at bottle temperatures of 550-600°C.…”
Section: Introductionmentioning
confidence: 99%