Introduce a novel configurationof microchannel andhigh-conductivity insertsfor cooling of disc-shaped electronic components

Abstract

<jats:sec> <jats:title content-type="abstract-subheading">Purpose</jats:title> <jats:p>Electronic components’ efficiency is the cornerstone of technology progress. The cooling process used for electronic components plays a main role in their performance. Embedded high-conductivity material and provided microchannel heat sink are two common cooling methods. The former is expensive to implement while the latter needs micro-pump, which consumes energy to circulate the flow. The aim of this study is providing a new configuration and method for improving the performance of electronic components.</jats:p> </jats:sec> <jats:sec> <jats:title content-type="abstract-subheading">Design/methodology/approach</jats:title> <jats:p>To manage these challenges and improve the cooling efficiency, a novel method named Hybrid is presented here. Each method's performance has been investigated, and the results are widely compared with others. Considering the micro-pump power, the supply of the microchannel flow and the thermal conductivity ratio (thermal conductivity ratio is defined as the ratio of thermal conductivity of high thermal conductivity material to the thermal conductivity of base solid), the maximum disk temperature of each method was evaluated and compared to others.</jats:p> </jats:sec> <jats:sec> <jats:title content-type="abstract-subheading">Findings</jats:title> <jats:p>The results indicated that the Hybrid method can reduce the maximum disk temperature up to 90 per cent compared to the embedded high thermal conductivity at the same thermal conductivity ratio. Moreover, the Hybrid method further reduces the maximum disk temperature up to 75 per cent compared to the microchannel, at equivalent power consumption.</jats:p> </jats:sec> <jats:sec> <jats:title content-type="abstract-subheading">Originality/value</jats:title> <jats:p>The information in this research is presented in such a way that designers can choose the desired composition, the limited amount of consumed energy and the high temperature of the component. According to the study of radial-hybrid configuration, the different ratio of microchannel and materials with a high thermal conductivity coefficient in the constant cooling volume was investigated. The goal of the investigation was to decrease the maximum temperature of a plate on constant energy consumption. This aim has been obtained in the radial-hybrid configuration.</jats:p> </jats:sec>

Thermal performance of an environmentally friendly nanoliquid in a cabinet with two l-shaped heaters: application for electronic cooling

“…In the history of heat transfer science, natural convection within the enclosures has been thought of as a key issue due to its huge applications in scientific and industrial phenomena, such as electronic cooling, solar energy systems, heat exchangers, nuclear reactor cooling and more details can be found in previous literature (Baïri et al , 2014; Biswal and Basak, 2017; Buchberg et al , 1976; Catton, 1978; Dadsetani et al , 2020; Das et al , 2017).…”

Performance Improvement of a Double-Layer Microchannel Heat Sink via Novel Fin Geometry—A Numerical Study

“…The results show that good heat transfer effect can be achieved by using low-temperature jet injection and adding nano particles into the base liquid. Dadsetani et al [64] proposed a new method with mixing, which applied high thermal conductivity materials with a microchannel heat sink at the same time. The results show that the mixing method can significantly reduce the maximum temperature.…”

Effect of transverse and parallel magnetic fields on thermal and thermo-hydraulic performances of ferro-nanofluid flow in trapezoidal microchannel heat sink

“…Micro fluidic is an interdisciplinary science including different fields such as physical, chemistry, electronic, polymers, mechanic, nano and biomedical (Jha et al, 2018;Zhao et al, 2019). The most important application of microfluidic is in the cooling system of electronic chips (Sepehrnia and Rahmati, 2018;Khorasanizadeh and Sepehrnia, 2016;Khorasanizadeh and Seperhnia, 2018b;Dadsetani et al, 2019;Li et al, 2020;Goodarzi et al, 2019;Bahiraei et al, 2019;Safaei et al, 2016;Khorasanizadeh and Sepehrnia, 2018a). Heat sinks and microchannels are currently used as cooling tools.…”