Internal stress of epoxy resin modified with acrylic core-shell particles containing functional groups prepared by seeded emulsion polymerization

Nakamura, Yoshinobu; Tabata, H.; Suzuki, Hideto; Iko, Kazuo; Okubo, M.; Matsumoto, Tsunetaka

doi:10.1002/app.1987.070330317

Cited by 36 publications

(4 citation statements)

References 1 publication

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“…In a series of our investigations, [1][2][3][4][5][6][7] the effects of the morphology of cured epoxy resin with a two-phase structure on its properties were studied.…”

Section: Introductionmentioning

confidence: 99%

Effect of particle size on mechanical properties of epoxy resin filled with angular‐shaped silica

Nakamura

Yamaguchi

Okubo

et al. 1992

J of Applied Polymer Sci

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SYNOPSISEffect of particle size on the mechanical properties of cured epoxy resins has been studied. Resin was filled with angular-shaped silica particles prepared by crushing fused natural raw quartz. These particles were sorted into six groups having different mean sizes ranging from 2-47 pm. Flexural and compressive moduli of the cured epoxy resin slightly decreased with decrease in the particle size of the silica, whereas tensile modulus slightly increased. Flexural and tensile strengths increased with decrease in particle size. Fractured surfaces were observed using scanning electron microscopy to clarify the initiation point of fracture.

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“…In a series of our investigations, [1][2][3][4][5][6][7] the effects of the morphology of cured epoxy resin with a two-phase structure on its properties were studied.…”

Section: Introductionmentioning

confidence: 99%

Effect of particle size on mechanical properties of epoxy resin filled with angular‐shaped silica

Nakamura

Yamaguchi

Okubo

et al. 1992

J of Applied Polymer Sci

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“…Seeded emulsion polymerization was used generally to prepare hollow polymer particle [21], core/shell particle [22, 23]. It was found in our work that seeded dispersion polymerization could dissolve the problem mentioned above.…”

Section: Resultsmentioning

confidence: 96%

Preparation and properties of amphoteric polyacrylamide by seeded dispersion polymerization in ammonium sulfate solution

Wang

Miao³

et al. 2011

Polymer Engineering & Sci

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Amphoteric polyacrylamide (AmPAM) was prepared successfully through seeded dispersion polymerization with acrylamide, methacrylatoethyl trimethyl ammonium chloride and acrylic acid as comonomers in ammonium sulfate solution. It was characterized by 1 H nuclear magnetic resonance ( 1 H NMR) and elemental analysis. The particle morphology and apparent viscosity of polymer dispersion were obtained by optical microscope and rotary viscometer, respectively. AmPAM dispersion was obtained with low apparent viscosity. The process was smooth without high viscosity stage. The data of 1 H NMR spectrum and elemental analysis indicated that all monomers had participated in the polymerization. The seeded reaction time and the mass ratio of two parts of monomers had significant effects on the dispersion polymerization. The best conditions were seeded reaction time 1.75h and the mass ratio 0.75. The apparent viscosity of AmPAM dispersion depended on the number of particles, particle size and low molecular weight polymer concentration in the continuous phase. AmPAM showed both anti-polyelectrolyte effect and polyelectrolyte effect.

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“…To decrease this internal stress, acrylic resins are generally used as dispersed particles [4][5][6][7][8][9] or as interpenetrating polymer networks (IPN). 10,11 Because the PSA is in the form of a film, its thickness is uniform and it is less deformable than in the case of paste adhesives.…”

Section: Introductionmentioning

confidence: 99%

“…To decrease this internal stress, acrylic resins are generally used as dispersed particles4–9 or as interpenetrating polymer networks (IPN) 10, 11…”

Section: Introductionmentioning

confidence: 99%

UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors

Saiki

Yamazaki

Ebe

2008

J of Applied Polymer Sci

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To facilitate the fabrication of a reliable stacked package for a semiconductor, UV/heat dual curing of adhesives was investigated. The formulated adhesives contained acrylic monomer and epoxy resins. First, UV curing was conducted on the acrylic monomer, followed by heat curing. It was found that UV-curable acrylic monomers affected the adhesive's properties, e.g., adhesion, water absorption, and viscoelasticity. As the acrylic monomer, neopentylglycol diacrylate (NPGDA), trimethylolpropane triacrylate (TMPTA), dipentaerythritol hexaacrylate (DPHA), and tricyclodecanedimethanol acrylate (TCDDA) were used to investigate the effect of functional group numbers and structure. As a result, an acrylic monomer that has two functional groups with a rigid moiety (TCDDA) showed acceptable properties as adhesives for the fabrication, and thus a UV/heat-curing adhesive has been successfully developed.

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Internal stress of epoxy resin modified with acrylic core-shell particles containing functional groups prepared by seeded emulsion polymerization

Cited by 36 publications

References 1 publication

Effect of particle size on mechanical properties of epoxy resin filled with angular‐shaped silica

Effect of particle size on mechanical properties of epoxy resin filled with angular‐shaped silica

Preparation and properties of amphoteric polyacrylamide by seeded dispersion polymerization in ammonium sulfate solution

UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors

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