Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
DOI: 10.1109/iemt.1995.541050
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Internal capacitor of low temperature co-fired multilayer ceramic substrate

Abstract: T h i s paper discusses the internal capacitor of low temperature co-fired multilayer ceramic substrate (LTCC).I t includes materials , manufacturing process and r e l i a b i l i t y of internal capacitor.

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“…Metals such as Ag, Pd, Ag-Pd alloy, and Ni have been used as conductive materials because their sintering temperatures are close to that of conventionally used substrates. So far, several types of Ag powder have been used as electrode paste for LTCC substrates [1][2][3][4]. The particle characteristics of Ag powders affect their shrinkage behavior during the sintering, and when coarse Ag powders with a broad size distribution and aggregation are used, they frequently show bending and cracking on the substrate.…”
Section: Troductiomentioning
confidence: 99%
“…Metals such as Ag, Pd, Ag-Pd alloy, and Ni have been used as conductive materials because their sintering temperatures are close to that of conventionally used substrates. So far, several types of Ag powder have been used as electrode paste for LTCC substrates [1][2][3][4]. The particle characteristics of Ag powders affect their shrinkage behavior during the sintering, and when coarse Ag powders with a broad size distribution and aggregation are used, they frequently show bending and cracking on the substrate.…”
Section: Troductiomentioning
confidence: 99%