There are various occurrences and root causes that result in no-fault-found (NFF) events but an intermittent fault (IF) is the most frustrating. This paper describes the challenging and most important area of an IF detection and health monitoring that focuses toward NFF situation in electronics interconnections. The experimental work focuses on mechanically-induced intermittent conditions in connectors. This paper illustrates a test regime, which can be used to repeatedly reproduce intermittence in electronic connectors, while subjected to vibration. A novel algorithm is used to detect an IF in interconnection. It sends a sine wave and decodes the received signal for intermittent information from the channel. This algorithm has been simulated to capture an IF signature using PSpice (electronic circuit simulation software). A simulated circuit is implemented for practical verification. However, measurements are presented using an oscilloscope. The results of this experiment provide an insight into the limitations of existing test equipment and requirements for future IF detection techniques. Aside from scheduled maintenance, this paper considers the possibility for in-service intermittent detection to be built into future systems, i.e., can IFs be captured without external test gear? Index Terms-Fault diagnosis, fault detection, NFF, and intermittent fault detection. I. INTRODUCTION M OST DEVICES and systems contain embedded electronics modules for monitoring, control, and to enhance the functionality of cars, trains, ships, and aeroplanes. The shrinking size and complexity of electronic circuits, with added redundancies, have led to difficulties in the maintenance of these systems. This becomes a challenge when faults are intermittent in nature. Intermittent faults (IFs) are a growing problem in electronics interconnection systems, especially for aircraft, satellites, and other vehicle industries and are safety critical to unmanned/autonomous connected vehicles. Interconnections have significantly increased in modern systems and these are prone to high stress of temperature, humidity, power fluctuation, electromagnetic interference, critical timing, aging, and vibration.