Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure

Abstract

Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0-1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag 2 Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd) 2 Al with a hexagonal structure.

Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

“…The interfacial reaction of ACA wire is similar to those found in previous Au-Al interfacial studies. 4,[10][11][12] To further confirm the change of microstructure in the ACA wire during current loading, we considered three different experimental times: 60 min, 720 min, and 1440 min (Fig. 8).…”

“…2 Related studies on silver-based wire have concentrated on silver alloys. Recent advances have illustrated significant improvements in reliability for Ag-8Au-3Pd 3,4 or Ag-4Pd wire. 5 Although Ag-alloy wire exhibits good reliability for wire bonding, its electrical properties degrade as a result of alloying with Pd and Au elements.…”

Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires

“…All data are the average of 10-12 experimental repetitions. A free air ball (FAB) was formed by the electronic flame-off (EFO) process with a wire-bonding machine (55 mA, 15 ms), the first FAB bond of which was on 800 nm aluminum pads [10,11]. To prevent oxidation, a 95% nitrogen-5% hydrogen gas mixture was used during the EFO process.…”

Aluminum Wires have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties and Bonding Characteristics of Nano Zn Film Al-Si Bonding Wires

“…A free air-ball (FAB) was formed by the electronic flame-off (EFO) process with a wire-bonding machine (55mA, 15ms), the first FAB bond of which was on 800nm aluminum pads [8][9]. To prevent oxidation, a 95% nitrogen-5% hydrogen gas mixture was used during the EFO process.…”

“…Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [10][11][12][13][14] and the bias-tensile test of the wires with different currents was measured. The schematic diagram in Fig.…”