Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints

Schmitt, Peter; Kaiser, Pascal; Savio, Christian; Tranitz, M.; Eitner, Ulrich

doi:10.1016/j.egypro.2012.07.126

Cited by 49 publications

(22 citation statements)

References 6 publications

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“…This implies that this section of the solder interconnection is a critical failure site where crack initiation and propagation is most likely to begin. This observation agrees with the experimental observation by Schmitt et al [22] whose result showed greater solder joint degradation at the solder/Ag interface. Figure 11 shows the hysteresis loop of solder for six thermal cycles which was plotted using equivalent creep strain and stress.…”

Section: Study On Equivalent Stresssupporting

confidence: 93%

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Zarmai

Ekere

Oduoza

et al. 2017

Robotics and Computer-Integrated Manufacturing

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The soldering process of interconnecting crystalline silicon solar cells to form photovoltaic (PV) module is a key manufacturing process. However, during the soldering process, stress is induced in the solar cell solder joints and remains in the joint as residual stress after soldering. Furthermore, during the module service life time, thermo-mechanical degradation of the solder joints occurs due to thermal cycling of the joints which induce stress, creep strain and strain energy. The resultant effect of damage on the solder joint is premature failure, hence shortened fatigue life. This study seeks to determine accumulated thermo-mechanical damage and fatigue life of solder interconnection in solar cell assembly under thermo-mechanical cycling conditions. In this investigation, finite element modelling (FEM) and simulations are carried out in order to determine nonlinear degradation of SnAgCu solder joints. The degradation of the solder material is simulated using Garofalo-Arrhenius creep model. A three dimensional (3D) geometric model is subjected to six accelerated thermal cycles (ATCs) utilising IEC 61215 standard for photovoltaic panels. The results demonstrate that induced stress, strain and strain energy impacts the solder joints during operations. Furthermore, the larger the accumulated creep strain and creep strain energy in the joints, the shorter the fatigue life. This indicates that creep strain and creep strain energy in the solder joints significantly impacts the thermo-mechanical reliability of the assembly joints. Regions of solder joint with critical stress, strain and strain energy values including their distribution are determined. Analysis of results demonstrates that creep energy density is a better parameter than creep strain in predicting interconnection fatigue life. The use of six ATCs yields significant data which enable better understanding of the response of the solder joints to the induced loads. Moreover, information obtained from this study can be used for improved design and better-quality fabrication of solder interconnections in solar cell assembly for enhanced thermo-mechanical reliability

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Section: Study On Equivalent Stresssupporting

confidence: 93%

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Zarmai

Ekere

Oduoza

et al. 2017

Robotics and Computer-Integrated Manufacturing

View full text Add to dashboard Cite

show abstract

“…In this approach, the cell is removed from the module, mounted in an epoxy and the cross-section is exposed through polishing. Chemical analysis is also possible through energy dispersive x-ray analysis (EDX), permitting an in-depth study of the metallic phases near the bond [66,67]. Clearly, this technique requires destroying the original cell, but useful information about the solder bond quality, such as voids and cracks, may be obtained, which could then be used for process optimization.…”

Section: Imaging Techniquesmentioning

confidence: 99%

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Davis

Rodgers

Scardera

et al. 2016

Renewable and Sustainable Energy Reviews

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This article is the third and final article in a series dedicated to reviewing each process step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock, crystallization and wafering, cell fabrication, and module manufacturing. The goal of these papers is to identify relevant metrology techniques that can be utilized to improve the quality and durability of the final product. The focus of this article is on the module manufacturing process. The c-Si PV module fabrication process can be divided into three primary areas; (1) stringing and tabbing, (2) lamination, and (3) integration of junction box and bypass diode(s). Each of these processing steps can impact the reliability and durability of PV modules in the field. The ultimate goal of this article is to identify appropriate metrology techniques and characterization methods that can be utilized within a module manufacturing facility to improve the reliability and durability of the final product. Additionally, a gap analysis is carried out to identify areas in need of further research and a discussion is provided that addresses new challenges for advanced materials and emerging technologies.

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“…The intermetallic compounds, which will decrease the joints performance and module reliability, appear mainly at the interfaces of copper/solder (CuSn) and solder/metalization (AgSn). The thickness of intermetallics increase with soldering temperature and time [3].…”

Section: Introductionmentioning

confidence: 98%

The effect of soldering process on solar module performance

Cao

Yang

Wang

2014

2014 IEEE 40th Photovoltaic Specialist Conference (PVSC)

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The aim of this work is to investigate the effect of soldering technology on solar module performance and reliability. In this study, the flux, the soldering temperature of soldering iron, and the annealing process during soldering process are investigated. Through a series of experiments, some meaningful conclusions which agree with practical production can be summarized as follows:it will be hard to joint if the flux with a low activity, while a too high activity will lead to corrosion at the same time; the optimal soldering temperature range is between 330�350 "C, which causes a low cell breakage rate and a high adhesion; annealing process can lead to less cell crack and low breakage rate by making copper more softer. These results have guiding significance for improving solar module manufacture and further enhancing module reliability and performance.

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Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints

Cited by 49 publications

References 6 publications

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

The effect of soldering process on solar module performance

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