Intermetallic Formation in the Aluminum–Copper System

Hannech, E. B.; Lamoudi, N.; Benslim, N.; Makhloufi, B.

doi:10.1142/s0218625x03005396

Cited by 32 publications

(12 citation statements)

References 16 publications

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“…The non-equilibrium diffusivity between Al and Cu promotes the Kirkendall effect of void formation, which is supposed to weaken the bond strength of the material with prolonged sintering. [14][15][16][17] However, no obvious voids are observed form the fractographs shown in Figs. 12 and 13, when the bond strength of the material starts to decrease in the present study.…”

Section: (C)-(d) and 13(c)-(d)mentioning

confidence: 89%

“…As the sintering time and/or temperature increase, the Kirkendall effect becomes more significant with the agglomeration of voids, which leads to the formation of weak layers in the interface region. [15][16][17] In this study, Al/Cu bimetal plates are made using cold roll bonding. The development of interfacial structure is performed and identified at different sintering conditions.…”

Section: Introductionmentioning

confidence: 99%

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Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

2006

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The aim of this article is to study the influence of interfacial structure development at interface on the fracture mechanism and the bond strength of cold roll bonded Al/Cu bimetal plate. The Al/Cu bimetal plates are produced by cold roll bonding and then sintered at different conditions. The bond strength of the Al/Cu bimetal plate increases generally to maximum values and then decreases to low values with increasing sintering temperature and time. Interfacial structures develop with increasing sintering temperature and time. The main interfacial layers are Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The formation and thickening of those intermetallic compounds promotes cracks propagation and weakens the bond strength of the bimetal plates. The fracture mechanism transforms from ductile to brittle cleavage with the development of interfacial structures. While the bond strength of the material starts to decrease, no obvious Kirkendall effect of void formation is observed in the present study.

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Section: (C)-(d) and 13(c)-(d)mentioning

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

2006

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“…However, if the annealing time and/or temperature exceed a certain value, the development of interfacial structure leads to the formation of weak layers in the interfacial region and damage the bonds. [5][6][7][8] Al/Cu joint rapidly loses its mechanical integrity when the total width of intermetallic phases exceeds 1 um. However, some questions require further studies and the interfacial structure for misfit materials needs to be investigated in depth.…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

2007

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The aim of this study is to investigate the structure development and growth kinetics of the interfacial structure of cold roll bonded Al/Cu bimetal sheet. An interfacial structure is developed during the annealing process. The characteristics of the constituent phases at the interface of Al/Cu bimetal are studied by means of scanning electron microscope (SEM), X-ray diffraction (XRD) and transmission electron microscope (TEM). The results indicate that an obvious multi-layers interdiffusion structure is developed at the Al/Cu interface. The diffusion layer is consisted of four intermetallic compounds; Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The growth of these intermetallics during annealing can be achieved by the diffusion process. The activation energies of Al 2 Cu, AlCu + Al 3 Cu 4 , Al 4 Cu 9 and the total intermetallic layer are found to be 97.504, 107.46, 117.52 and 107.85 kJ/mol, respectively. These intermetallics generally possess higher hardness values than those of the corresponding base metals. AlCu and Al 3 Cu 4 exhibit much higher hardness than that of Al 2 Cu and Al 4 Cu 9 , which implies lower fracture toughness. The observation of crack propagation paths shows that fracture mainly occurs in the intermetallic compound layers of AlCu and Al 3 Cu 4 , which are located between Al 2 Cu and Al 4 Cu 9 .

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“…There are many publications regarding the Al/Cu bilayers, partly in the scope of the VLSIdevices research. Besides bilayers, thin films of Cu on Al substrate [4] as well as two bulk samples in contact were studied [5]. A detailed phase formation sequence in dependence of Al: Cu atomic ratio is given by Vandenberg and Hamm [3].…”

Section: Introductionmentioning

confidence: 99%