Intermetallic compounds formation and joints properties of electroplated Sn–Zn solder bumps with Cu substrates

Hou, Zhuangzhuang; Niu, Te; Zhao, Xiuchen; Liu, Ying; Yang, Tianqi

doi:10.1007/s10854-019-02412-8

Cited by 6 publications

(3 citation statements)

References 25 publications

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“…Various studies have been carried out as an alternative to Sn-Pb solder alloy. Sn-Zn [5,6], Sn-Cu [7], Sn-Ag [8] and Sn-Bi [9]. Sn-based lead-free solder alloys have been reported as potential candidates.…”

Section: Introductionmentioning

confidence: 99%

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Oguz,

Erer

2023

Phys. Scr.

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In this study, the wetting and microstructural properties of SACBi-xAl (x=0.05, 0.1, 0.3, 0.5, and 0.6%) quinary lead-free solder alloys produced by adding various amounts of Al to the quaternary SAC-1Bi lead-free solder alloy (wt%) were investigated. The wetting and microstructural properties of Al-added quinary lead-free solder alloys on Cu substrate in an Ar gas atmosphere were investigated. It wasreported that the best wetting angle (38.44° for the 325℃ temperature value) and melting temperature (212.5℃) belonged to the SACBi-0.1Al solder alloy. When the microstructural properties are examined, it is seen with the help of SEM images that the CuAl IMC phase, which is rich in Al, has replaced Cu6Sn5 and Ag3Sn IMCs.

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Section: Introductionmentioning

confidence: 99%

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Oguz,

Erer

2023

Phys. Scr.

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“…In addition, tin-based alloys also have better wear resistance, tensile strength, and fatigue resistance, which makes them useful in applications that require high strength and durability [6]. They also have good welding properties, which facilitate their application in manufacturing processes [7,8], and do not constitute a hazardous substance, such as lead alloys, which are prohibited by the EU's Restriction of Hazardous Substances (RoHS) [7][8][9][10]. The Sn-Sb alloys are commonly used as patent metal in various applications, such as in the manufacture of batteries, electronic equipment, automotive parts, and kitchen utensils, among others [4,6].…”

Section: Introductionmentioning

confidence: 99%

Influence of Solidification Parameters and Solute Content on the Machinability of Two Lead-Free Babbit Metals

Costa Maciel

2023

Current Trends in Eng Sc

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Studies suggest that white metal Sn-Sb alloys are the most commonly type of babbit metal used in industry. However, it is necessary to evaluate manufacturing characteristics and solute contents that leads the best machining conditions. This work presents a correlation between solidification parameters and machinability of Sn-2.0wt%Sb and Sn-5.5wt%Sb alloys, solidified in a horizontal directional device, evaluating the influence of solute content on these results. Cutting temperatures were measured in dry necking processes along the length of the ingot. It was observed that the reverse cellular-dendritic transition influenced the cutting temperature results. The range of cell and dendrite spacings varies approximately from 40 to 330 μm on the Sn-2.0wt%Sb alloy and from 15 to 240 μm on the Sn-5,5wt%Sb alloy. In the cellular region, higher values are found for the Sn-5.5wt%Sb alloy, but in the dendritic region, these values were higher for the Sn-2.0wt%Sb alloy.

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“…A number of studies have been carried out by both the academia and the industry, to develop a low temperature lead-free solder alloy, based on Sn–Zn or Sn–Bi solder alloys (Suganuma and Kim, 2007; Jackson et al , 2012; Hou et al , 2019; Hu et al , 2019; Shen et al , 2019; Shen et al , 2019; Wang et al , 2019; Yu et al , 2019; Ramos et al , 2020). Among them, Sn–Zn–Bi-based solder alloys are regarded as a potential “drop-in” replacement because of their relatively low melting temperature (Noor and Ogundipe, 2017; Al-Ezzi, Al-Bawee et al , 2019), which is similar to that of conventional Sn-37Pb (Ren and Collins, 2017).…”

Section: Introductionmentioning

confidence: 99%

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

Ren

Collins

2020

SSMT

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Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep tests under stresses of 20–40 MPa and temperature range 25°C–75 °C. Dorn power law and Garofalo hyperbolic sine law were used to model the secondary creep rate. Findings High coefficient of determination R2 of 0.99 is achieved for both the models. It was found that the activation energy of Sn–8Zn–3Bi solder alloy can be significantly increased with addition of Sb, by 60% to 90 kJ/mol approximately, whereas the secondary creep exponent falls in the range 3–7. Improved creep resistance is attributed to solid solution strengthening introduced by micro-alloying. Creep mechanisms that govern the deformation of these newly developed lead-free solder alloys have also been proposed. Originality/value The findings are expected to fill the gap of knowledge on creep behaviour of these newly developed solder alloys, which are possible alternatives as lead-free interconnecting material in low temperature electronic assembly.

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Intermetallic compounds formation and joints properties of electroplated Sn–Zn solder bumps with Cu substrates

Cited by 6 publications

References 25 publications

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Influence of Solidification Parameters and Solute Content on the Machinability of Two Lead-Free Babbit Metals

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

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