Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Bang, Junghwan; Yu, Dong-Yurl; Ko, Yong-Ho; Son, Junhyuk; Nishikawa, Hiroshi; Lee, Chang-Woo

doi:10.1016/j.microrel.2019.05.019

Cited by 24 publications

(5 citation statements)

References 29 publications

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“…In accordance with the data that have already been published, the addition of Al2O3 + NiO nanoparticles (Al2O3 + NiO nanoparticles) to the Sn-Zn alloy significantly reduces the thickness of the intermetallic layer during solid/liquid interdiffusion [32,33] due to the fact that the presence of both nano additives prevents Fe diffusion, resulting in a thinner diffusion layer as well as a uniform thickness of the intermediate layer in Sample 5 [16].…”

Section: Microstructure and Interfacesupporting

confidence: 87%

Effect of Al2O3 and NiO Nanoparticle Additions on the Structure and Corrosion Behavior of Sn—4% Zn Alloy Coating Carbon Steel

et al. 2023

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The application of a higher corrosion resistance coating modified with nano additions can effectively decrease or prevent corrosion from occurring. In the present work, a novel method is successfully developed for the modification of carbon steel surfaces aiming for high corrosion resistance using Sn—4% Zn alloy/nanoparticle composite (NiO+ Al2O3) coating. Sn—4% Zn alloy/nanoparticle composite (NiO+ Al2O3) coatings were deposed on carbon steel using a direct tinning process that involved a power mixture of Sn—4% Zn alloy along with a flux mixture. Regular coating and interface structures were achieved by individual Al2O3 and both NiO and Al2O3 nanoparticle combined additions in the Sn-Zn coating. The maximum coating thickness of 70 ± 1.8 µm was achieved for Al2O3 nanoparticles in the Sn-Zn coating. Interfacial intermetallic layer thickness decreased with all used nanoparticle additions in individual and hybrid conditions. The minimum intermetallic layer thickness of about 2.29 ± 0.28 µm was achieved for Al2O3 nanoparticles in the Sn—Zn coating. Polarization and impedance measurements were used to investigate the influence of the incorporated Al2O3, NiO, and hybrid Al2O3/NiO nanoparticles on the passivation of the low-carbon steel (LCS) corrosion and the coated Sn—Zn LCS in sodium chloride solution. It was found that the presence of Al2O3, NiO, and Al2O3/NiO nanoparticles remarkably improved the corrosion resistance. The corrosion measurements confirmed that the corrosion resistance of the coated Sn-Zn carbon steel was increased in the presence of these nanoparticles in the following order: Al2O3/NiO > NiO > Al2O3.

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Section: Microstructure and Interfacesupporting

confidence: 87%

Effect of Al2O3 and NiO Nanoparticle Additions on the Structure and Corrosion Behavior of Sn—4% Zn Alloy Coating Carbon Steel

et al. 2023

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“…Nonetheless, lead-free legislation, environmental concerns and customer preferences are urged many studies to prepare lead-free solders [4,5]. Since, commercial solder used are on the basis of tin comprising binary, ternary and quaternary alloys, a number of tin-based lead-free solders are thoroughly studied to meet up with the reliability and performance of conventional Sn-Pb solders [6,7].…”

Section: Introductionmentioning

confidence: 99%

Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy

Subri

Sarraf

Ali

et al. 2019

Corrosion Engineering, Science and Technology

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The present study attempted to assess the corrosion performance of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) lead-free solder alloy in NaCl-based solutions. Potentiodynamic polarisation measurements indicated that in acidic or alkaline solutions, corrosion potential (Ecorr) shifted to more negative (active) values and the corrosion current density (icorr) visibly increased. In a neutral pH solution, SAC105 solder alloys exhibited notable corrosion resistance owing to the stability of passive film formed on the surface of solder alloys. Potentiodynamic polarisation curves also showed that the addition of 0.05 wt% Fe and 1 wt% Bi improved the corrosion rate of SAC105 and lowered the Ecorr towards more noble value due to the reduced micro-galvanic interaction between the cathodic Ag3Sn IMCs and the anodic Sn matrix. Immersion tests revealed that the mass loss increased in the order: SAC105-Fe-2Bi > SAC105 > SAC105-Fe-1Bi.

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“…The CrSn 2 IMCs that were produced during the fabrication of the alloy were precipitated near the IMC layers and dispersed. Moreover, the existence of some products was detected at the Cu 6 Sn 5 grain boundary [17]. These results suggested that the addition of Cr to the Sn-0.7Cu solder effectively prevented the increase in the thickness of the Cu 6 Sn 5 IMCs.…”

Section: Resultsmentioning

confidence: 82%

“…The addition of trace elements may decrease the diffusion rate of IMC by lowering the activity of Cu and Su elements or blocking the diffusion path of atoms in a liquid-solid reaction state. Additionally, the mechanical strength may be improved by a composite microstructure close to the prediction of the dispersion reinforcement theory [15][16][17][18][19][20]. However, the impact of Cr addition to the commercial Sn-0.7Cu solder on the initial formation and growth of IMCs is unexplored.…”

Section: Introductionmentioning

confidence: 90%

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Son

Dong

Kim

et al. 2021

Metals

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The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240–300 °C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 °C in both the solders, and the particle size increased at 280 and 300 °C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components.

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Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Cited by 24 publications

References 29 publications

Effect of Al2O3 and NiO Nanoparticle Additions on the Structure and Corrosion Behavior of Sn—4% Zn Alloy Coating Carbon Steel

Effect of Al2O3 and NiO Nanoparticle Additions on the Structure and Corrosion Behavior of Sn—4% Zn Alloy Coating Carbon Steel

Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

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