Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

Huang, Xi; Zhang, Liang; Zhang, Jia-Min; Chen, Chen; Lu, Xiao; Sun, Lei

doi:10.1016/j.matchar.2023.113618

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Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

Cited by 4 publications

References 38 publications

Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints

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