Intergranular stress corrosion cracking of copper in nitrite solutions

Mori, Gregor; Scherer, Doris; Schwentenwein, Sandra; Warbichler, Peter

doi:10.1016/j.corsci.2004.09.024

Cited by 28 publications

(10 citation statements)

References 24 publications

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“…As an example, body-centred cubic (BCC) and hexagonal close packed (HCP) crystals usually show ductile-to-brittle transition at decreasing temperatures [10][11][12], with inter-and transgranular cracking resulting from the limited number of slip systems in these crystal lattices at low temperatures. On the other hand, although face-centred cubic (FCC) lattices generally favour ductile deformation over a wide range of temperatures as consequence of the large number of slip systems, the action of aggressive environments is well-known to induce grain boundary embrittlement and therefore intergranular and transgranular fracture in naturally ductile materials [13][14][15]. At room temperature, HPC ceramics, such as 6H silicon carbide (SiC), exhibit inter-and transgranular brittle fracture [16].…”

Section: Introductionmentioning

confidence: 99%

Modelling intergranular and transgranular micro-cracking in polycrystalline materials

Gulizzi

Rycroft

Benedetti

2018

Computer Methods in Applied Mechanics and Engineering

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In this work, a grain boundary formulation for intergranular and transgranular micro-cracking in three-dimensional polycrystalline aggregates is presented. The formulation is based on the displacement and stress boundary integral equations of solid mechanics and it has the advantage of expressing the polycrystalline problem in terms of grain boundary variables only. The individual grains within the polycrystalline morphology are modelled as generally anisotropic linear elastic domains with random spatial orientation. Transgranular micro-cracking is assumed to occur along specific cleavage planes, whose orientation in space within the grains depend upon the crystallographic lattice. Both intergranular and transgranular micro-cracking are modelled using suitably defined cohesive laws, whose parameters characterise the behaviour of the two mechanisms. The algorithm developed to track the inter/transgranular micro-cracking history is presented and discussed. Several numerical tests involving pseudo-3D and fully 3D morphologies are performed and analysed. The presented numerical results show that the developed formulation is capable of tracking the initiation and evolution of both intergranular and transgranular cracking as well as their competition, thus providing a useful tool for the study of damage micro-mechanics

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Section: Introductionmentioning

confidence: 99%

Modelling intergranular and transgranular micro-cracking in polycrystalline materials

Gulizzi

Rycroft

Benedetti

2018

Computer Methods in Applied Mechanics and Engineering

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“…Indeed, statements have been made that ''SCC is practically unknown in commercial copper'' [5]. However, in the same volume and in more recent analyses, SCC in pure elements has been reported [5][6][7][8][9][10][11][12][13]. Ammonia is the most often quoted chemical constituent associated with SCC in coppers [5].…”

Section: Stress Corrosion Cracking (Scc)mentioning

confidence: 97%

Stress Corrosion Cracking of Tough Pitch Copper in a Bolting Application

Maciejewski

Akyüz

2008

J Fail. Anal. and Preven.

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Stress corrosion cracking was observed in C11000 and C10200 copper electrical feedthrough pins used in a bolting application. The component provided the balancing tensile stress required for compression of a gasket seal of a refrigeration compressor. The component, as designed, had functioned without failure for years of production and thousands of units. The fractures were mixed brittle intergranular with ductile microvoid dimples. An extensive analysis of actual failed samples as well as a process of elimination methodology indicated that the fractures were due to SCC by an unidentified chemical species within the sealed compressor chamber. A unique combination of applied stress, residual stress, a stress riser, and fine-grain size isolated the failure mechanism to a single production lot of material.

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“…It is due to the biogenic ammonical action (Syrett and Coit, 1983) of Bacillus sp. After ammonia formation the following possible reaction takes place (Todt et al, 1961;Mori et al, 2005 The enhancement of anodic current in polarization study can be explained that the corrosion on cupronickel is due to the oxidation of Cu(OH) 2. Besides, the inter granular attack is formed due to over saturation of the [Cu (NH 3 ) 4 ] 2+ ions (Kirchberg et al,2001;Mori et al, 2005 andKuznika andJunik , 2007 Formation of CuO at the metal surface is the critical step for the occurrence of stress corrosion cracking (SCC) that was noticed on XRD which supports with the observation made by Mori et al (2005).…”

Section: Atomic Force Microscopementioning

confidence: 99%

Impact of ammonia producing Bacillus sp. on corrosion of cupronickel alloy 90:10

et al. 2009

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The objective of the present investigation is characterization of ammonia producing bacteria (Bacillus sp.) and its impact on biodeterioration of cupronickel alloy 90:10. It is well known that iron sulphate and molybdenum are good inhibitors used in cooling water system. The role of interaction between inhibitor and ammonia producing bacteria on corrosion of cupronickel 90:10 was studied. Cupronickel coupons were immersed in Chavara rare earth containing backwater for a period of six months. The predominated ammonia producing bacteria were isolated from the six months old biofilm. A total of four ammonia producing Bacillus sp. (AG1-EU202683; AG2-EU202684; AG3-EU202685 and AG4-EU202686) were isolated from the biofilm and identified by 16S rRNA gene sequencing. The corrosion rate of cupronickel in water (System I) was in the range of 0.046mm/year and 0.052mm/year. In the control system II (Chavara water and nitrogen free medium without bacteria), the corrosion rate was 0.008 mm/year whereas in the presence of Bacillus sp. AG1 and AG3, the corrosion rate was in the range of 0.023 and 0.030mm/year. These bacteria fixed atmospheric nitrogen for their cell protein synthesis and converted into ammonia. Ammonia enhanced pH and ammonical solution was formed in the presence of Bacillus sp. that acted as an etchant. The presence of some anodic spots in the presence of bacteria was affected by ammonia and underwent pitting 2 corrosion. The present study reveals that Bacillus sp. encourage intergranular attack without any stress to the cooling water system.

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Intergranular stress corrosion cracking of copper in nitrite solutions

Cited by 28 publications

References 24 publications

Modelling intergranular and transgranular micro-cracking in polycrystalline materials

Modelling intergranular and transgranular micro-cracking in polycrystalline materials

Stress Corrosion Cracking of Tough Pitch Copper in a Bolting Application

Impact of ammonia producing Bacillus sp. on corrosion of cupronickel alloy 90:10

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