Interferometric Analysis of Thermomechanical Deformations in Thermoelectric Generators

Morschel, Marlis; Bastian, G.

doi:10.1007/s11664-012-2364-3

Cited by 6 publications

(4 citation statements)

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“…To ease the interpretation of these functions, the evaluation functions n i;mech ¼ 1 À J i;mech and n el ¼ ÀJ el are introduced and the mechanical evaluation functions (10) are further summarized by weighting the evaluation values by its objective functions standard deviation related to the sum of the standard deviations of all mechanical objective functions (11).…”

Section: Objective Functionsmentioning

confidence: 99%

“…They also stated that the thickness of the insulator had no significant influence on the power output, as long as the thermal flow remains constant and that there is a maximum power output depending on the thickness of the solder layer. The deflection of a 40 Â 40 Â 4.2 mm 3 TEM while exposed to a hot side's temperature of 250°C was evaluated experimentally by Morschel and Bastian [11]. They measured a maximum deflection of 1000 nm at the hot side and concluded a possible influence on the surface contact pressure distribution and therefore the thermal contact resistance between TEM, thermal interface material (TIM) and heat exchanger.…”

Section: Introductionmentioning

confidence: 99%

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Parameter optimization of thermoelectric modules using a genetic algorithm

Heghmanns

Beitelschmidt

2015

Applied Energy

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Section: Objective Functionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Parameter optimization of thermoelectric modules using a genetic algorithm

Heghmanns

Beitelschmidt

2015

Applied Energy

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“…Analysis of thermomechanical deformations in thermoelectric generators were performed using electronic speckle pattern interferometry [40], where temperature gradients as well as small surface deflections in the μm range had to be measured simultaneously. Koch…”

Section: Espi Todaymentioning

confidence: 99%

Simultaneous ESPI Measurements Using Multiple Wavelengths and a Color Camera

Richoz

Schajer

2014

Advancement of Optical Methods in Experimental Mechanics, Volume 3

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Electronic Speckle Pattern Interferometry (ESPI) is typically done using a single monochromatic light source with a monochrome camera. This arrangement enables full-field measurements of a single deformation quantity according to the particular arrangement of the optical system. If a further deformation quantity is to be measured, then the associated optical arrangement must be used sequentially. Here, an alternative approach is described where multiple interferometric measurements are simultaneously made using a color camera imaging monochromatic light sources of different wavelengths. The Red-Green-Blue (RGB) sensors of a conventional Bayer type camera can be read separately, thereby providing three independent color signals and independent ESPI phase maps. An example case is demonstrated here where two Michelson interferometers are combined to form a shearography camera with surface slope sensitivity in two perpendicular directions. By the use of two colors, both surface slopes can be measured simultaneously. ESPI is a relative measuring technique and the third available color is used for absolute phase determination through the Two-Wavelength Method. The availability of the two surface slopes gives the opportunity for the data to be summed numerically to give the surface displacement shape. This application is of significant practical interest because the surface displacement measurement can be made under field conditions by taking advantage of the wellknown stability of shearography measurements.

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“…They demonstrated the importance of the mismatch between the thermal expansion coefficient of the pins and solder materials to secure the low stress levels in the device. Thermo‐mechanical deformation in thermoelectric generators was examined by Morschel and Bastian . They used an optical and thermography camera to create a holistic image of the deformation to analyze the influence of deformation on the thermoelectric generator structure.…”

Section: Introductionmentioning

confidence: 99%

A model study for cyclic thermal loading and thermal performance of a thermoelectric generator

Almerbati

Yilbaş

Sahin

2014

Int. J. Energy Res.

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SUMMARY Thermal cyclic loading influences the life cycle of the thermoelectric device pins because of the thermal stress developed in the pins. Although thermal efficiency improves for different geometric configurations of the device pins, development of thermal stresses limit the selection of pin geometry in practical applications, particularly under cyclic thermal loading. Consequently, in the present study, thermal stress analysis of thermoelectric pins under cyclic thermal loading is carried out. The influence of thermoelectric pin geometry on the stress levels is examined when the device is subjected to the thermal cyclic loading. The predictions of thermal stress distribution are validated with the data presented in the open literature. It is found that pin geometric configuration has a significant effect on the stress levels developed in the pin when subjected to cyclic thermal loading. The pin configuration RA = 1 (parallel pins) results in the minimum value of the maximum von Mises stress in the pins as compared to that corresponding to other configurations. Copyright © 2014 John Wiley & Sons, Ltd.

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Interferometric Analysis of Thermomechanical Deformations in Thermoelectric Generators

Cited by 6 publications

References 1 publication

Parameter optimization of thermoelectric modules using a genetic algorithm

Parameter optimization of thermoelectric modules using a genetic algorithm

Simultaneous ESPI Measurements Using Multiple Wavelengths and a Color Camera

A model study for cyclic thermal loading and thermal performance of a thermoelectric generator

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