Abstract:A high‐quality joint of the parent metal Al‐25Si‐4Mg‐1Cu alloy (AlSi alloy) was brazed to itself using Zn layer as a filler material. The typical microstructure of AlSi/Zn/AlSi joint was Al‐Zn solid solution, primary Si phase and α‐Al phase. When brazing temperature was increased from 400 to 405°C, Zn began to melt and reacted with Al diffused from base material, then Si phase formed. While the increase in brazing temperature to 415°C caused the gradual buring of Zn from Al‐Zn solid solution, and α‐Al remained… Show more
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