Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates

Yen, Yee‐Wen; Tsai, Po-Hao; Fang, Yang-kai; Lo, Shao-cheng; Hsieh, Yi-Ping; Lee, Chiapyng

doi:10.1016/j.jallcom.2010.04.241

Cited by 53 publications

(29 citation statements)

References 20 publications

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“…The composition of intermetallics was confirmed by energy dispersive X-ray analysis (EDX). Similar results were obtained by others researcher [8,9,10]. Besides that, a needle-like of (Ni,Cu) 3 Sn 4 was observed near outside area/Ni-B.…”

Section: Resultssupporting

confidence: 91%

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Azlina

Ourdjini

Ibrahim

2015

AMM

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Abstract. In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and also offer better properties. This study investigates the comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes. Reliability of solder joint has been assessed by performing solid state isothermal aging at 150ºC for 250 up to 2000 hours. After reflow soldering process, (Cu,Ni) 6 Sn 5 intermetallic compound (IMC) is dominated at near centre of solder meanwhile (Ni,Cu) 3 Sn 4 IMC is dominated at near outside of solder ball . Moreover, aging time resulted in an increase in thickness and changed the morphology into more spherical, dense and large grain size. Analysis by optical microscope revealed that the IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during reflow as well as isothermal aging.

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Section: Resultssupporting

confidence: 91%

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Azlina

Ourdjini

Ibrahim

2015

AMM

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“…This mechanism can also be observed in the SZ/Pd/Ni/Cu system. 35 Figure 8 shows the relationship between the total IMC thickness and the square root of reaction time in the SZ/Au/Ni/SUS304 couples reacted at various reaction temperatures. It can be seen that the thickness of the total IMC layer increases with higher reaction temperature and longer reaction time.…”

Section: Resultsmentioning

confidence: 99%

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Yen

Liaw

Chen

et al. 2010

Journal of Elec Materi

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The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni 3 Sn 4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni 5 Zn 21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.

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“…The Ni layer is widely adopted as a diffusion barrier material to prevent rapid reaction between the Cu and solder induced by Cu diffusion. [5][6][7] The ENEPIG layer has a thin Pd layer (0.05 lm to 0.1 lm) which should be plated before immersion Au plating. The thin Pd layer between the Ni and Au is a sacrificial layer, and the substitution process of Pd with Au, instead of Ni, can prevent dissolution of Ni during immersion Au plating.…”

Section: Introductionmentioning

confidence: 99%

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Yoon

Noh

Jung

2011

Journal of Elec Materi

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Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

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Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates

Cited by 53 publications

References 20 publications

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

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