Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips

Huang, M. L.; Pan, Jianling; T, H; Zhao, Nana

doi:10.1179/1743284712y.0000000017

Cited by 5 publications

(2 citation statements)

References 19 publications

(33 reference statements)

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“…Eutectic soldering is often used in the encapsulation process for its excellent wettability, flowability, processability, physical properties (thermal conductivity and electrical conductivity), chemical properties (anti-corrosion), and mechanical properties (strength, elongation, creep resistance, fatigue resistance, and structure stability) of the solder [7][8][9]. Gao [10] has used Ti6Al4V and Inconel 718 to solve welding problems, Oliveira [11] has used NiTi to solve weldability problems, and niobium has been used as an interlayer by Oliveira [12] to prevent the formation of brittle phases when joining NiTi to Ti6Al4V.…”

Section: Introductionmentioning

confidence: 99%

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

Zhao

Gong

Jiang³

et al. 2020

Crystals

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In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the cross sections of the chip soldering samples show that with gradually increasing soldering temperature, the phase composition is not affected, and all the joint structures are an Au + Si eutectic structure; the Au–Si eutectic reaction occurs during the soldering process. No deposition of meta-stable phases, such as Au7Si, Au5Si, or Au3S, is found. A soldering temperature of 420 °C can reduce the negative impacts of secondary cap welding soldering on the joint and improve the structure and mechanical properties of the joint.

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Section: Introductionmentioning

confidence: 99%

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

Zhao

Gong

Jiang³

et al. 2020

Crystals

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“…Metals, including copper, nickel, tin, chromium, silver and gold, can be plated. 1,2 However, electroplating production becomes environmentally harmful, as this industrial process generates a large amount of electroplating effluents. 3,4 For instance, nearly 400 million tons of effluents containing heavy metals are produced in China every year.…”

Section: Introductionmentioning

confidence: 99%

Tribological behaviours of Cu nanoparticles recovered from electroplating effluent as lubricant additive

Meng

Zhang

Zhao

et al. 2014

Tribology - Materials, Surfaces & Interfaces

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Nowadays, many efforts have been made to minimise the pollution risks of copper electroplating effluent, such as chemical methods, physical methods, etc. Among them, chemical reduction has been used in this paper for its simplicity and potential for industrial production, and the recovered Cu nanoparticles (CuNPs) were innovatively used as a lubricant additive to prolong the lifetime of lubrication equipment and enhance energy conservation via emission reduction. In this paper, the relationships of the remaining Cu 2z concentration ([Cu 2z ]) with NaBH 4 /CuSO 4 mole ratio, reaction time and reaction temperature were discussed separately. Then, L 9 (3 3 ) orthogonal experiment was carried out to determine optimal reaction conditions. Finally, the tribological behaviours [e.g. friction coefficients (FCs) and wear scar diameter (WSD)] of base oil samples with and without addition of the recovered CuNPs were investigated. Results indicate that the optimal reaction conditions were as follows: NaBH 4 /CuSO 4 (4 : 6) react at 30uC for 25 min, under which [Cu 2z ] was minimised to 0?2 mg L 21 with a mean particle size of 33 nm. The FC and WSD of oil with 0?3 wt-%CuNPs were decreased by 33?4 and 19% respectively compared with the base oil. This compound oil was much more suitable for moderate load and high load than for low load. This paper provides a new idea on dealing with the copper electroplating effluent.

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