Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples

Yen, Yee‐Wen; Lin, Chien-Yu; Hermana, Gita Novian; Chen, Pei-Yu; Wu, Yi-Pin

doi:10.1016/j.jallcom.2017.03.285

Cited by 12 publications

(7 citation statements)

References 33 publications

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“…Several ternary phases were also found in the Sn-3.5Ag-0.7Cu/42 alloy, 9 Sn-Zn/Au, 26 Sn/Ni-W, 27 and Au/Sn-Zn/Cu systems. 28 The layered structure with a darker color between T 1 and T 2 layers was the second (Cu, Be) 6 Sn 5 phase. This result verified that Sn diffusion occurred in the layered T 1 structure and formed the second (Cu, Be) 6 Sn 5 layer with the Cu atoms from the Alloy 25 substrate.…”

Section: Resultsmentioning

confidence: 99%

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Chang

Pasana

et al. 2021

Journal of Elec Materi

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The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. The couples were reacted at 240-270°C for 0.5-10 h. The results revealed that only the scallop-shaped (Cu, Be) 6 Sn 5 phase was formed at 240°C for 0.5-2 h in the Sn/Alloy 25 couple. At a longer time (> 4 h) or higher temperature (255°C and 270°C), the (Cu, Be) 3 Sn phase was observed at the interface. In the SAC/Alloy 25 couple, the results were similar to that in the Sn/Alloy 25 couples. Only the scallopshaped (Cu, Be, Ag) 6 Sn 5 phase was formed for the short reaction time or at lower reaction temperature. With increasing reaction times and temperatures, both the (Cu, Be, Ag) 6 Sn 5 and (Cu, Be, Ag) 3 Sn phases were observed at the SAC/Alloy 25 interface. In the SZ/Alloy 25 couple, the (Cu, Sn)Zn 5 and (Cu, Sn) 5 Zn 8 phases were observed. Of these three couples, the intermetallic compound (IMC) thickness obeyed the parabolic law, and the IMC growth mechanism was diffusion-controlled.

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Section: Resultsmentioning

confidence: 99%

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Chang

Pasana

et al. 2021

Journal of Elec Materi

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“…Other alternatives, such as Co [28] and Sn-Zn [33], have been investigated to replace Ni. However, Co, compared to Ni, has a higher cost and a lower corrosion resistance, and both Sn and Zn are reactive elements that can form intermetallic compounds with Au and Cu.…”

Section: Figure 2 Contacts Of a Typical Contact Smart Card And A Brimentioning

confidence: 99%

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Bahramian¹,

Eyraud²,

Vacandio³

et al. 2019

Microelectronic Engineering

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“…and ceramic (e.g., Al 2 O 3 , ZrO 2 , TiO 2 , SiC etc.) elements into the Sn-based solder could suppress the formation of voids and retard the growth of IMCs [10][11][12][13][14][15]. Cu is a basic element in the lead-free solder.…”

Section: Introductionmentioning

confidence: 99%

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

Chen

Zhang

et al. 2018

Applied Sciences

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In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and pure Sn solder. After aging processes, a new IMC, Cu3Sn, was formed at the interface, in addition to Cu6Sn5 formed in the as-soldered joints. The EP Cu and Cu addition (0.7%) both had limited effects on the total IMCs thickness. However, the effects varied on the growth behaviors of different IMCs. Comparing to the void-free interface between Sn and HP Cu, a large number of voids were observed at the Cu3Sn/Cu interface in Sn/EP Cu joints. The formation of these voids may be induced by the impurities and fine grain, which were introduced during the electroplating process. The addition of Cu suppressed the inter-diffusion of Cu and Sn at the interface. Consequently, the growth of the Cu3Sn layer and formation of voids were suppressed.

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Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples

Cited by 12 publications

References 33 publications

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

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