Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process

Koo, Jaseung; Yoon, Jeong‐Won; Jung, Seung‐Boo

doi:10.1002/sia.2193

Cited by 9 publications

(3 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The reaction layer was too thin to determine its chemical composition exactly using EDS and EPMA analyses. It was reported in the previous study using transmission electron microscope (TEM) analysis that the reaction layer formed between the Ni 3 (Sn,In) 4 and Ni-P layer during the liquid/solid reaction was Ni 3 P [12].…”

Section: Microstructurementioning

confidence: 99%

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Koo

Jung

2007

Microsyst Technol

Self Cite

View full text Add to dashboard Cite

Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn 2 , Ni 3 (Sn,In) 4 and Cu 6 (Sn,In) 5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu 6 (Sn,In) 5 and Cu(Sn,In) 2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

show abstract

Section: Microstructurementioning

confidence: 99%

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Koo

Jung

2007

Microsyst Technol

Self Cite

View full text Add to dashboard Cite

show abstract

“…In a similar fashion, when Sn-In is reflowed on a Au/Ni 9 or Al/Ni 10 substrate, while the Cu is prevented from diffusing into the solder, the results show that spalling of the Au-rich or Al-rich IMC into the solder also alters the solder microstructure, in turn decreasing its strength. Koo et al, in several articles, 9,11,12 presented findings from studies of the interactions between Sn-In solder with Ni/Au and electroless nickel immersion gold (ENIG) platings. For both substrates studied, essentially two IMCs appear, with different compositions and growth rates.…”

Section: Introductionmentioning

confidence: 98%

Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

Daghfal

Shang

Liu

et al. 2009

Journal of Elec Materi

View full text Add to dashboard Cite

Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/ SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni 3 Sn 4 and FeSn 2 phases appeared at the interface along with Cu 6 Sn 5 in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni 3 Sn 4 crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.

show abstract

“…Recently, some researchers have analyzed the interfacial reactions between eutectic In-Sn alloys and different substrates, such as Cu and Ni/Cu [16], Au [40], Nb [41], and electroless Ni/immersion Au [19,42]. For example, the interfacial layer between the In-Snbased alloy and the Cu substrate consists of two compounds, namely, the Cu-rich Cu 2 (In,Sn) near the Cu side and the In-rich Cu 2 In 3 Sn near the alloy side [17,43].…”

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

View full text Add to dashboard Cite

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

show abstract

Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process

Cited by 9 publications

References 12 publications

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Contact Info

Product

Resources

About