Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate

Li, Chao; Hu, Xiaowu; Jiang, Xiongxin; Li, Yulong

doi:10.1007/s00339-018-1907-8

Cited by 14 publications

(4 citation statements)

References 36 publications

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“…Growth kinetics of IMC layer during the solid-state isothermal ageing can be described according to the empirical power-law relationship as following [ 30 , 31 ]:

where Xt is the IMC thickness (m) at ageing time t (s), Xo is the initial thickness of IMC layer after reflow soldering and D is the diffusion coefficient (m 2 /s) and n is the time exponent. The value of time exponent n could be considered as an indicator to dictate the controlling mechanism for the growth of IMC layer.…”

Section: Resultsmentioning

confidence: 99%

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Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

et al. 2021

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This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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“…Growth kinetics of IMC layer during the solid-state isothermal ageing can be described according to the empirical power-law relationship as following [ 30 , 31 ]:

Section: Resultsmentioning

confidence: 99%

“…Growth kinetics of IMC layer during the solid-state isothermal ageing can be described according to the empirical power-law relationship as following [30,31]:…”

Section: Growth Kinetics Of Imc Layermentioning

confidence: 99%

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

et al. 2021

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“…Some studies demonstrated that submicron voids could be formed because of Kirkendall voids within the TLP layers of Cu-Sn [23,33,34], Ni-Sn [35], and Ag-Sn [23] systems. The Kirkendall voids were also observed in joints consisting of Sn-based solders and Cu [15,[36][37][38]. Yu et al reported that the formation of Kirkendall voids as the diffusion rate of Cu atoms is much higher than that of Sn atoms in the Cu 3 Sn layer between the Cu substrate and SAC305 solder [36].…”

Section: Discussionmentioning

confidence: 99%

“…The mechanical properties of the Cu-Sn IMCs indicate higher strengths and creep resistances compared to conventional Sn-based solders [14]. These properties indicate that the Cu-Sn transient liquid-phase sintered (TLPS) joints could be appropriate as a temperature resistant method for power electronics applications; however, Cu-Sn IMCs have been generally used for the purposes of crack formation in conventional soldering because of their quite brittle and stiff properties [15][16][17]. These mechanical properties of the IMCs cause joint fracture during thermal stresses despite the higher melting point of the TLP joints [18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

et al. 2019

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The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds partially filled with polyimide resin, was obtained by the pressure-less TLP sintering process at 250 °C for 1 min using a novel Cu-solder-resin composite as a bonding material in a nitrogen atmosphere. Experimental results indicate that the TLPS joints were mainly composed of Cu, Cu6Sn5, and Cu3Sn in the as-bonded state, where submicron voids were observed at the interface between Cu3Sn and Cu particles. After thermal aging at 150, 175, and 200 °C for 1000 h, the Cu6Sn5 phase fully transformed into Cu3Sn except at the chip-side interface, where the number of the submicron voids appeared to increase. The averaged shear strengths were found to be 22.1 (reference), 22.8 (+3%), 24.0 (+9%), and 19.0 MPa (−14%) for the as-bonded state and specimens aged at 150, 175, and 200 °C for 1000 h, respectively. The TLPS joints maintained a shear strength over 19 MPa after thermal aging at 200 °C for 1000 h because of both the positive and negative impacts of the thermal aging, which include the transformation of Cu6Sn5 into Cu3Sn and the formation of submicron voids at the interface, respectively. These results indicate an excellent thermal reliability of the TLPS Cu–Sn skeleton microstructure.

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Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints

et al. 2018

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Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate

Cited by 14 publications

References 36 publications

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints

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