Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate

Cheng, Jinxuan; Hu, Xiaowu; Jiang, Xiongxin

doi:10.1016/j.vacuum.2018.10.024

Cited by 19 publications

(3 citation statements)

References 34 publications

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“…The formation of a thin and continuous intermetallic compound layer during welding is necessary for good wetting and connections and improves the mechanical properties of solder joints [46]. However, since intermetallic compounds are brittle, an excessively thick compound layer will significantly reduce the reliability of solder joints.…”

Section: Interfacial Reactions Of the Solder Alloys With Cu Sheetmentioning

confidence: 99%

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

et al. 2023

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In this study, we investigated the microstructure, mechanical properties, and thermal performance of Sn-xBi-1Ag (x = 35, 37, 45, and 47 wt.%) solders, with a particular focus on the effect of adding trace Si atoms. The impact of different Ag concentrations on the properties of Sn-xBi-Ag-0.5Si solders was also studied. The results indicated that as the amount of Bi added to Sn-xBi-1Ag solder alloys increased, the tensile strength, microhardness, melting temperature, and melting range decreased somewhat, but the wettability improved. The Cu6Sn5 layer between the soldering alloy and the Cu substrate became thinner upon increasing the Bi content. Adding microcrystalline Si atoms to the Sn-Bi-1Ag alloy improved the tensile strength and microhardness, but the melting point and melting range were not significantly changed. The wettability was optimized, and the diffusion layer formed with the Cu matrix was significantly thinner. By increasing the Ag content in the Sn-Bi-(1,3)Ag-0.5Si alloy, the tensile strength of the alloy was continuously strengthened, while the hardness decreased slightly and the melting point and melting range increased slightly. The wettability was greatly improved, and the Cu6Sn5 layer became thinner.

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Section: Interfacial Reactions Of the Solder Alloys With Cu Sheetmentioning

confidence: 99%

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

et al. 2023

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“…In recent years, the emergence of through Si via (TSV) and wafer level package (WLP) has driven the development of 3D microelectronic packaging [2]. Solder joints provide mechanical support and electronic connection for electronic components, which will meet greater thermal and mechanical challenges in 3D packages [3]. Due to the harm of Pb to the environment and human health, legislation has banned Pb usage in commercial electronic products [3].…”

Section: Introductionmentioning

confidence: 99%

“…Solder joints provide mechanical support and electronic connection for electronic components, which will meet greater thermal and mechanical challenges in 3D packages [3]. Due to the harm of Pb to the environment and human health, legislation has banned Pb usage in commercial electronic products [3]. A series of lead-free solders such as SnAg, SnAgCu, SnCu, SnZn, and SnBi solders have been invented to replace the traditional Pbcontained solders [4].…”

Section: Introductionmentioning

confidence: 99%

Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

Cong

Liu

Wang

et al. 2023

Mater. Res. Express

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In this work, the capacitor solder joints were aged at 50 ℃, 75 ℃, 100 ℃, 125, and 150 ℃ from 100 h to 1000 h. The intermetallic compounds (IMCs) layer growth of Sn36Pb2Ag on hot air solder leveled (HASL) pad and electroless nickel/immersion gold (ENIG) pad was measured. Based on the empirical power-law of the IMC growth and the Arrhenius relationship between diffusion coefficient and aging temperature, a method to predict the IMC growth at a selected temperature was developed. The mechanical property of capacitor solder joints after thermal aging was investigated through the shear test. Through analysis of the fracture surface, the mixed fracture mode of ductile and brittle was exhibited. The porous structure of the Cu coating on the capacitor electrode was determined to be the origin of the crack.

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Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

Jiang

Chen

et al. 2019

J Mater Sci: Mater Electron

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Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate

Cited by 19 publications

References 34 publications

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

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Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate

Cited by 19 publications

References 34 publications

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

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Product

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Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate