2006
DOI: 10.1111/j.1551-2916.2005.00924.x
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Interfacial Peeling Moments and Shear Forces at Free Edges of Multilayers Subjected to Thermal Stresses

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Cited by 6 publications
(12 citation statements)
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“…32 Some studies pointed out that the thickness ratio had a significant influence on the flexural strength of the bilayered systems. [4][5][6][7][8][9][10][11][12][13][14] That may be related to a different test method, the nature of the interface, and the properties of the materials, especially Young's modulus and flexural strength of each material. 4,5,7,8,13 Table 2 shows that the failure loads measured are close to the predicted values, confirming the validity of the failure load prediction model (Fig 4).…”
Section: Discussionmentioning
confidence: 99%
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“…32 Some studies pointed out that the thickness ratio had a significant influence on the flexural strength of the bilayered systems. [4][5][6][7][8][9][10][11][12][13][14] That may be related to a different test method, the nature of the interface, and the properties of the materials, especially Young's modulus and flexural strength of each material. 4,5,7,8,13 Table 2 shows that the failure loads measured are close to the predicted values, confirming the validity of the failure load prediction model (Fig 4).…”
Section: Discussionmentioning
confidence: 99%
“…4,14 Hsueh et al 13 pointed out that the location of the maximum tensile stress of bilayered discs in a biaxial bending test changed with the thickness ratio, thus, the strength and failure mode can be affected; however, some studies found that strength was not dependent on the thickness ratio. 6,7,10 The different conclusions indicate that the effect of thickness ratio has not been clearly revealed. Hence, investigating the stress distribution in the beams is paramount to understanding the effect of the thickness ratio on their strength and failure mode.…”
mentioning
confidence: 96%
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“…Titanium is used due to its adhesion properties to metal and silicon. Also, following layer deposition, layer peeling, de-lamination, or separation due to thermal stress was a risk due to the different thermal expansion coefficients of Cu, Si, and SiO 2 [72] and the rapid cooling from 350 C to room temperature post-fabrication, but this phenomena was not observed in this experiment.…”
Section: Fabrication Of the Proposed Structurementioning
confidence: 81%
“…To obtain a narrow absorption band around the desired resonant frequency, the number of alternating layers can be increased. Although this is conceptually a simple technique to achieve high Q-factors, typically > 100, the fabrication process can be challenging as thickness and stress of each layer must be accurately controlled for a large number of layers [72].…”
Section: Conductor Backed Frequency Selective Structurementioning
confidence: 99%