Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping

Liu, X.-Y.; Nuhfer, Noel T.; Rollett, Anthony D.; Sinha, Shyam Kanta; Lee, S.-B.; Carpenter, John S.; Ledonne, Jon; Darbal, Amith; Barmak, K.

doi:10.1016/j.actamat.2013.10.046

Cited by 43 publications

(20 citation statements)

References 45 publications

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“…Data were collected over a series of five runs that encompassed areas of size 2 μm × 2 μm with a step size of 6 nm. Additional technical details of PED are available in the previous literature343541. The phase map in Fig.…”

Section: Resultsmentioning

confidence: 99%

“…The evolution of the layer morphology of the CARB Cu/V composites was investigated with decreasing individual layer thickness ranging from micrometer to nano-scale. A new electron diffraction based characterization method, precession electron diffraction (PED)3435, was employed to obtain texture distributions, grain size and shape and layer thickness statistics information in the CARB Cu/V nanocomposites. This new method not only provides data similar to that of electron backscatter diffraction (EBSD) studies, but also has finer resolution than EBSD, especially for severely strained metals.…”

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confidence: 99%

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Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

Zeng

Gao

Xie

et al. 2017

Sci Rep

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Traditional nanostructured metals are inherently comprised of a high density of high-energy interfaces that make this class of materials not stable in extreme conditions. Therefore, high performance bulk nanostructured metals containing stable interfaces are highly desirable for extreme environments applications. Here, we reported an attractive bulk Cu/V nanolamellar composite that was successfully developed by integrating interface engineering and severe plastic deformation techniques. The layered morphology and ordered Cu/V interfaces remained stable with respect to continued rolling (total strain exceeding 12). Most importantly, for layer thickness of 25 nm, this bulk Cu/V nanocomposite simultaneously achieves high strength (hardness of 3.68 GPa) and outstanding thermal stability (up to 700 °C), which are quite difficult to realize simultaneously in traditional nanostructured materials. Such extraordinary property in our Cu/V nanocomposite is achieved via an extreme rolling process that creates extremely high density of stable Cu/V heterophase interfaces and low density of unstable grain boundaries. In addition, high temperature annealing result illustrates that Rayleigh instability is the dominant mechanism driving the onset of thermal instability after exposure to 800 °C.

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Section: Resultsmentioning

confidence: 99%

mentioning

confidence: 99%

Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

Zeng

Gao

Xie

et al. 2017

Sci Rep

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“…PED acquisitions were performed on FEI Tecnai G2 F20 S-Twin FEG scanning/transmission electron microscope (S/TEM) operating at 200 KeV and spot size of nine (~1 nm [10]) with the external device NanoMEGAS (Brussels, Belgium) attachment. The incident beam was controlled by an upper coil above the specimen plane and simultaneously precessed with a pre-defined precession angle varying between 0-3° (1.3° in this study).…”

Section: Experimental Approachesmentioning

confidence: 99%

High Resolution Spatial Mapping of Deformation in Ti‐Based Alloys

Ghamarian

Liu

Samimi

et al. 2016

Proceedings of the 13th World Conference on Titanium

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High spatial resolution (~1-2 nm) of ASTAR /PED, an emerging transmission electron microscope-based orientation microscopy technique, enables the quantitative characterization of defects induced during deformation in historically difficult to characterize materials such as ultrafine grained and severely deformed metallic materials.This work presents the extension of the aforementioned orientation microscopy technique to automatically quantify the defect structures induced during deformation, including specifically the density distribution of geometrically necessary dislocations (GNDs) in a severely deformed ultrafine grained commercially pure titanium. Also, the dislocation density evolution of a two-phase alpha/beta titanium alloy (i.e., Ti-5553) during micro indentation test is presented.

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“…This is because with this method multilayered materials on a bulk scale can be obtained. In the past decade, deformation of the ARB-processed composite materials has been widely investigated [9][10][11][12][13][14][15][16][17]. In addition to the plane strain compression loading applied by the rollers, the ARB-processed metal surfaces also undergo shear deformation, due to the large friction between the metal and the roll surfaces.…”

Section: Introductionmentioning

confidence: 99%

Inhomogeneous Deformation of Multilayered Roll-Bonded Brass/Cu Composites

Jia

Zhu

Zheng

et al. 2015

Acta Metall. Sin. (Engl. Lett.)

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The deformation gradients in multilayered hot roll-bonded composite materials incorporating two dissimilar face-centered cubic metals, i.e., brass and Cu, were investigated by characterizing the deformation microstructure, hardness and texture at different thickness positions of the composites. For the constitutive metals, the center part of each metal sheet forms the substructure containing coarse grains, while the ultrafine grains and significant shear banding form in the outer part. As deformation increases, the cross-interface shear occurs in the Cu sheet of the composites. Then, grain fragmentation, shear banding and dynamic recovery become the main factors that influence hardness of the metal. Moreover, in the co-deformed composites, the interface between brass and Cu plays a role in texture developments of the individual metals.

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Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping

Cited by 43 publications

References 45 publications

Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

High Resolution Spatial Mapping of Deformation in Ti‐Based Alloys

Inhomogeneous Deformation of Multilayered Roll-Bonded Brass/Cu Composites

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