Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

Bi, Wenzhen; Ju, Guokui; Lin, Fei; Xie, Shifang; Wei, Xicheng

doi:10.1108/09540911211262539

Cited by 6 publications

(4 citation statements)

References 21 publications

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“…The isothermal aging of the Sn-0.7Cu solder/Ni BGA joint has been studied by Yoon et al [85]. The interaction between the Ni layer and molten solder established a (Cu, Ni Bi, Ju and Lin [3] examined the impact of introducing elemental Bi and Er to a low Ag solder alloy Sn-x(1.0, 1.5, 2.0)Ag-0.3Cu-3.0Bi-0.05Er on the development of the interfacial IMC layer (wt.%). The IMC layer thickness at the interface of a Cu/SACBE/Cu joint was discovered to be much less than that of a Cu/SAC/Cu joint.…”

Section: Effect Of Aging Time and Temperaturementioning

confidence: 99%

“…Moreover, the solder alloy reacts with the substrate during the soldering process, forming an interfacial IMC layer at the interface. Its development has a substantial impact on the solder joint's reliability [3]. In soldering, a thin coating of interfacial intermetallic is recommended to establish effective metallurgical bonding at the interface.…”

Section: Introductionmentioning

confidence: 99%

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Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

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Section: Effect Of Aging Time and Temperaturementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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“…Therefore, a coating of Ni over the Cu metallization is often used as a diffusion barrier (Chan et al, 2002). Studies have been reported on the reaction of different solders with Cu substrates (Ju et al, 2014;Zhu and Sun, 2017;Bi et al, 2012;Yan et al, 2016) and Ni/Cu substrates during reflow and ageing (Huang and Lin, 2004;Lee et al, 2005;Mittal and Lin, 2012;Mittal and Lin 2014;Tian et al, 2003). Reaction of Sn-Ag, Sn-Cu and Sn-Bi solders with Ni substrates leads to the formation of Ni 3 Sn 4 IMC, whereas the Sn-Zn solder alloy reacts with Ni to form the Ni 19 Zn 80 Sn IMC (Chan et al, 2002).…”

Section: Introductionmentioning

confidence: 99%

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Mittal

Lin²

2018

SSMT

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Purpose This paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation to the formation of intermetallic compounds (IMCs). Design/methodology/approach The Sn-Zn solder is reflowed on Ni/Cu substrates and is aged at 503 K. The formation of IMCs and their composition is characterized using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX). Diffusion coefficients and diffusion distances of Zn, Ni and Sn in the liquid state during reflow and ageing are theoretically calculated. Both experimental and theoretical behaviours for Ni and Zn diffusions are compared. Findings Calculations show a linear increment in the liquid-state diffusion coefficients of Ni, Zn and Sn in the solder matrix with a rise in temperature, but they remained constant during ageing. However, diffusion distances increased slowly with temperature but manifold with ageing time. The experimental results revealed segregation of Zn and Ni at the interface in the as-reflow aged specimens. The Zn was concentrated at the solder–substrate interface and it reacted with Ni diffusing from the substrate to form Ni-Sn-Zn IMCs. The rapid diffusion of Zn and Ni with the increase in ageing time increased their atomic concentrations in the IMCs against the reduction in Sn concentration owing to a comparatively slower diffusion. Originality/value The novelty of the paper is the detailed study of theoretical diffusion of Zn, Sn and Ni in the liquid state during reflow ageing of Sn-Zn above its melting points on a Ni/Cu substrate. This is compared with values obtained experimentally and related to the mechanisms of IMC formation.

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“…A lot of researches have been done to solve these problems, for example, adding a certain content of Bi in SAC0307 can reduce the melting point of solder and improve the wettability 7) . The addition of Bi or Be in the SAC solder could limit the growth of the intermetallic compound (IMC) and improve the mechanical properties of solder 8,9) . A kind of low-temperature stirring soldering of low-silver SAC solder was studied by Gan, which found that the IMC growth of joint was signi cantly inhibited by adding Ni nanoparticles 10,11) .…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

Luo

Gan

et al. 2016

Mater. Trans.

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A new type of low-silver hypoeutectic SAC lead-free solder was prepared, and then hot dip soldering was used to form the joints of copper. The microstructure evolution of IMCs and the variation of shear strength of solder joints were investigated. The results have shown that the thickness of the IMC layer increased over time and the scallop-type IMC became a hump like shape during the aging process. The growth rates of the IMC layer were 0.61 × 10 −14 cm 2 /s, 2.06 × 10 −14 cm 2 /s, 4.83 × 10 −14 cm 2 /s at 348 K, 373 K and 423 K respectively. The shear strength of solder joint fell sharply at rst and then became slow, nally dropped from 40.94 MPa to 29.73 MPa after aging at 423 K for 12 days. Moreover, the fracture mode changed from ductile fracture to local brittle fracture with the increasing of aging time.

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Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

Cited by 6 publications

References 21 publications

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

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