Interfacial fracture induced by cross-sectional nanoindentation in metal–ceramic thin film structures

Elizalde, M.R.; Sánchez, J.M.; Martı́nez-Esnaola, J.M.; Pantuso, D.; Scherban, T.; Sun, B.; Xu, Guofeng

doi:10.1016/s1359-6454(03)00256-8

Cited by 50 publications

(28 citation statements)

References 29 publications

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“…A jump-in observed in the load-displacement curve was associated with the interfacial cracking. Based on the linear elastic fracture mechanics and plate theory, the interfacial critical energy release rate was calculated [55,56]. CSN was often used for identifying the weakest interface in multilayer structures and for characterizing interfacial adhesion [13,[56][57][58].…”

Section: Interfacial Failure Induced By Substrate Crackingmentioning

confidence: 99%

Deformation, failure and removal mechanisms of thin film structures in abrasive machining

Kang¹,

Huang²

2017

Adv. Manuf.

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Thin film structures are becoming increasingly more important for industrial applications such as the making of solar panels, microelectronic devices and micro systems. However, the challenges encountered in the machining of thin film structures have been a bottleneck that impedes further wide spread uses of such structures. The development of material removal processes that are capable of producing a damage free surface at high removal rates is critical for cost effective production. Such development relies highly on a comprehensive understanding of the deformation, failure and removal mechanisms of thin film structures involved in mechanical loading. In this paper, the current understanding of the deformation characteristics of thin film systems was reviewed to provide important insights into the interfacial failure under mechanical loading, with focuses on the interfacial failure mechanisms and existing problems in the machining of thin film structures. The key characterization techniques were outlined. In particular, the recent progress in the abrasive machining of a thin film multilayer structure was summarized. The potential research directions were also presented in the end of the review.

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Section: Interfacial Failure Induced By Substrate Crackingmentioning

confidence: 99%

Deformation, failure and removal mechanisms of thin film structures in abrasive machining

Kang¹,

Huang²

2017

Adv. Manuf.

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“…After the critical load was determined, the cracking process in bending was further studied by a simulation of a debonding process of specified crack surfaces. 24,30 The bonded surfaces of the coating and substrate in the interface were modeled as two contact surfaces, which were stuck together before the load exceeded the critical load. When the load reached the critical value, the crack propagation capability was activated and the initial bonded surfaces with a specified length (crack length) from the original location of the crack tip were separated.…”

Section: Fracture Toughness Of the Interfacial Crackmentioning

confidence: 99%

Interfacial adhesion measurement of a ceramic coating on metal substrate

Nie

Zhou

et al. 2009

J Coat Technol Res

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The interfacial adhesion measurement of a ceramic coating on a metal substrate is studied by three-point bending (3PB) technique. In the measurement, interfacial cracks are induced during the 3PB test, and the interfacial energy release rate is calculated from the released energy per unit crack surface area during crack extension under the fixed displacement conditions. A finite element analysis (FEA) model encompassing the plastic behavior of the metal substrate is developed to simulate the 3PB test and extract the energy data. The inputs to the FEA model include the crack length, the maximum and critical loads corresponding to crack initiation, and the mechanical properties of the coating and substrate. A MoB/CoCr ceramic coating/stainless steel substrate system is investigated by the technique for demonstrating the utility of the technique.

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“…1c), or a force from an indention close to the coating/substrate interface on the crosssection of a specimen with brittle substrate (Fig. 1d) (Sánchez et al, 1999;Elizalde et al, 2003;Ocana et al, 2006).…”

Section: Introductionmentioning

confidence: 99%

“…Hong et al (1990) showed the initial slope of load-deflection data increases with increasing the residual tensile stresses for the indentation on a free standing circular coating with its periphery fixed. And Elizalde et al (2003) mentioned that the residual compressive stresses help to open the interfacial crack and tensile stresses have the reverse effect.…”

Section: Introductionmentioning

confidence: 99%