Interfacial cracking in thin film structures

Adhesion studies in integrated circuit interconnect structures

“…The residual stresses can reach values as high as 1 GPa [5]. Research efforts carried out over the last decade have established a solid basis for the analysis of the interfacial decohesion by combining fracture mechanics models [6][7][8][9][10][11][12][13][14][15][16] with experimental calibration tests [15][16][17][18].…”