1986
DOI: 10.1016/0025-5416(86)90368-x
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Interfacial bond strength in an aluminium alloy 6061 — SiC composite

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Cited by 120 publications
(22 citation statements)
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“…The interface damping results from the mobility of the incoherent microstructure at the interface and interface slip. Generally speaking, there is a well bonded interface between SiC particulate and 6061Al matrix [14]. When the temperature is elevated above 100 • C, the metal matrix may become soft relative to the ceramic particulate, and a movement at the interface is likely to occur [11].…”
Section: Discussionmentioning
confidence: 99%
“…The interface damping results from the mobility of the incoherent microstructure at the interface and interface slip. Generally speaking, there is a well bonded interface between SiC particulate and 6061Al matrix [14]. When the temperature is elevated above 100 • C, the metal matrix may become soft relative to the ceramic particulate, and a movement at the interface is likely to occur [11].…”
Section: Discussionmentioning
confidence: 99%
“…3). Very high bonding strengths have been achieved in a tensile test on an AlMgSiCu alloy reinforced with silicon carbide particles [35]. The lower limit for bonding strength at the beginning of delamination was 1690 MPa.…”
Section: Bonding and Composite Strengthmentioning
confidence: 99%
“…At room temperatures, decohesion of the particles from the matrix is unlikely to occur, due to the high interface strength. Therefore, the probability of particle failure increases [21,24]. Larger particles provide a minor resistance against particle failure [4,15,25] and fatigue cracks initiate preferably at them due to the higher local stress concentration [12,17,26].…”
Section: Introductionmentioning
confidence: 99%