Interfacial bond strength and fracture energy at room and elevated temperature in titanium matrix composites (SCS-6/Timetal 834)

Zeng, Wenguang; Peters, P.W.M.; Tanaka, Yoshihisa

doi:10.1016/s1359-835x(02)00089-1

Cited by 41 publications

(25 citation statements)

References 11 publications

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“…3a represent an ideal Kelly-Tyson distribution. This profile is consistent with the observations of other studies for SCS-6 fibres in Ti matrices [13,17,39], indicating that stress transfer is occurring by the mechanism of frictional sliding. The interfacial shear stress at the fibre matrix interface can be deduced from the gradient in axial fibre strain de f /dz:…”

Section: Scs-6 Coated Fibre Systemsupporting

confidence: 92%

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Interfacial shear strength behaviour of Ti/SiC metal matrix composites at room and elevated temperature

2010

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Section: Scs-6 Coated Fibre Systemsupporting

confidence: 92%

“…Push-out [13], transverse tensioned push-out [14] and full fragmentation [11,15,16] testing have been applied previously to measure interface strength. All rely on micromechanics models and simplifying assumptions (e.g., constant radial clamping stresses along the fibre length) in order to back-out the interface properties.…”

Section: Introductionmentioning

confidence: 99%

Interfacial shear strength behaviour of Ti/SiC metal matrix composites at room and elevated temperature

2010

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“…shear strength) of the Cu/W multi-layer interface (429 MPa) is slightly higher than that of the Cu single-layer interface (393 MPa). These d values suggest a moderate shear strength compared to a carbon-coated glass fiber-reinforced cement composite (50 MPa) [10] or a SiC fiber-reinforced titanium composite (500 MPa) [11].…”

Section: Calibration Of Interfacial Parametersmentioning

confidence: 91%

Interfacial fracture behavior of tungsten wire/tungsten matrix composites with copper-coated interfaces

Höschen

Rasiński

et al. 2010

Materials Science and Engineering: A

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Order of Authors: Juan Du, MSc.; Till Höschen1, Dipl.-Ing.; Marcin Rasinski, MSc.; Jeong-Ha You, Dr.-Ing.Abstract: The potential application of tungsten as a structural material has been strongly restricted by inherent brittleness. The hitherto metallurgical efforts to improve tungsten toughness seem to be still less matured. The authors have been exploring a novel toughening technique based on reinforcement by tungsten wires. Toughness is supposed to be enhanced through the energy dissipation at the wire/matrix interfaces which is caused by the controlled crack deflection and friction. In this work, we focus on two kinds of copper coatings for interface engineering, namely, copper mono-layer and copper/tungsten multi-layer. Single filament composites were fabricated using magnetron sputtering and CVD process. The interfacial parameters were identified by means of fiber push-out test and microscopic fracture features were investigated. In this paper the results from the extensive push-out experiments are presented together with the fractographs. Finite element simulation was also carried out to estimate the plastic strain of the copper layer. Essential role of the significant plastic deformation in the overall failure behavior is highlighted.Response to the reviewers Reviewer1.The text paragraph was revised according to the reviewer's recommendation (many thanks).The corresponding references were updated [1, 2] and replaced [4]. Reviewer2.1) The manufacturing of the many filament bulk W/W composite materials is a current Ph.D thesis topic of one of my students (since 1 year). This highly challenging study treats the processing development including compaction.2) A direct quantitative comparison of the dissipated energy was added in page 6 line 9-12.3) Still we could not give a general statement about the correlation between ductility of the interface and shear strength, because our experimental result was obtained only for specific ad hoc case of Cu and Cu/W coating layers. We were not sure if metallurgical effects (bonding, wetting, roughness etc.) would have possibly played a more dominant role than the continuum mechanical factors. Figure 5 was improved. Figure 1 was explained in detail. 4) 5) All English corrections were made (many thanks).Response to the editor The mathematical equation was re-typed in according to the instruction. The revised text parts were marked in blue color. AbstractThe potential application of tungsten as a structural material has been strongly restricted by inherent brittleness. The hitherto metallurgical efforts to improve tungsten toughness seem to be still less matured. The authors have been exploring a novel toughening technique based on reinforcement by tungsten wires. Toughness is supposed to be enhanced through the energy dissipation at the wire/matrix interfaces which is caused by the controlled crack deflection and friction. In this work, we focus on two kinds of copper coatings for interface engineering, namely, copper single-layer and copper/tungsten multi-layer. Single ...

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“…The same procedure is followed to determine the frictional shear stresses making use of the minimum load after debonding. A real material property can be deduced if the non-homogeneous (shear) stress distribution along the fibre is considered either with the aid of analytical or finite element analyses [10][11][12].…”

Section: Characterization Of the Interface By Push-out Experimentsmentioning

confidence: 99%

The fibre/matrix interface and its influence on mechanical and physical properties of Cu-MMC

Peters¹,

Hemptenmacher²,

Schurmann³

2010

Composites Science and Technology

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Interfacial bond strength and fracture energy at room and elevated temperature in titanium matrix composites (SCS-6/Timetal 834)

Cited by 41 publications

References 11 publications

Interfacial shear strength behaviour of Ti/SiC metal matrix composites at room and elevated temperature

Interfacial shear strength behaviour of Ti/SiC metal matrix composites at room and elevated temperature

Interfacial fracture behavior of tungsten wire/tungsten matrix composites with copper-coated interfaces

The fibre/matrix interface and its influence on mechanical and physical properties of Cu-MMC

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