Interface Wetting and Reaction Behavior between Mold Flux and Submerged Entry Nozzle under an External Electric Field

Abstract

Herein, to provide theoretical foundation and experimental data for using electric field to control the service performance and improve the service life of submerged entry nozzle, the effect of the external electric field on the interfacial reaction and wetting behavior between the mold flux and the slag‐line materials is studied. It is shown in the results that the wettability of mold flux on the surface of the slag‐line materials is mainly affected by the dissolution and spreading under normal conditions. However, the electrochemical reaction and electric force generated by the applied electric field are also important factors for driving and changing the wettability between the mold flux and slag‐line materials. Under the positive electric field, the total duration of complete spreading and wetting is 227 s, which is 13 s shorter than that under normal conditions; the contact angle after complete wetting is about 17°, which is 1.5° lower than that under normal conditions. Under the negative electric field, the total duration of complete spreading and wetting is 260 s, which is 20 s longer than that under normal conditions; the contact angle after complete wetting is about 21°, which is 2.5° higher than that under normal conditions.