Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Fujiwara, Shigehiro; Dauskardt, Reinhold H.

doi:10.2320/matertrans.mb201203

Cited by 2 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…14) These reports suggested that soft Sn coating seems very effective for mechanically embedding Cu wire into soft substrate, and bonding condition and the as-received state of Sn coating can significantly influence the bonding mechanism, such as mechanical intermixing or metallurgical bonding with very thin IMC layer (e.g., less than 1 µm in thickness), especially in the vicinity of Cu wire.…”

Section: +1mentioning

confidence: 99%

Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

et al. 2015

View full text Add to dashboard Cite

This work aims to investigate the ultrasonic weldability of Al ribbon (width 2.0 mm © thickness 0.2 mm) to Cu sheet (thickness 1.0 mm) using a WC tool of 2.0 mm © 1.0 mm (sonotrode tip size) and to understand joint formation process by examining joint microstructures and fracture behavior for different bonding times. For the selected conditions of 20 W power, 30 N clamping force, 0.10.8 s bonding time, it was found that sound lap joints could be readily obtained when the bonding time reached and exceeded 0.4 s, which fractured within Al ribbon, but not along interface, owing to the formation of dense and thin alloying layer of 2³3 µm thickness with a continuous composition gradient. When such bonding has been established, the actual slipping motion shifted upwards to the top of Al ribbon. On the other hand, both microstructure and fracture surface observations indicated that in the early stage, localized adhesion occurred accompanied by the detachment of just adhered Al part from remaining Al ribbon body, leading to a cracking (called secondary interface) within weak Al ribbon. Thus, USW of Al ribbon to Cu sheet was achieved through a series of slipping at three kinds of transient interfaces: localized adhesion at original interface and alloying of the adhered Al together with detachment within Al ribbon (forming the secondary interface); re-bonding at the secondary interface together with further bonding at original interface under resisted slipping and high frictional coefficient as a result of surface roughening by previous isolated compound formation at original interface; and final upwards shifting of slipping to the third interface between top surface of Al ribbon and tool end.

show abstract

Section: +1mentioning

confidence: 99%

Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

et al. 2015

View full text Add to dashboard Cite

show abstract

“…Since the two lines have the same inclination, the shear interface strength does not change. If an accurate value of the interface strength or its distribution is required, a large number of pullout tests are necessary, and the microstructures of the solder and copper wire as well as their change near the copper/solder interface should be investigated [14,15].…”

Section: Evaluation Of Tensile and Shear Strengths Of The Copper/soldmentioning

confidence: 99%

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

et al. 2017

View full text Add to dashboard Cite

Abstract:Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost. The ends of these wires are usually joined to pads or through-holes on a printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the deformation resistance of solder is lower than that of copper, especially in slow deformation due to creep, the strain tends to be increased in the solder and concentrated near the copper/solder joint interface. Thus, fracture frequently occurs at this interface and may influence the quality of the product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wire from lead-free solder were carried out, and the pullout behavior of the wires was observed. The bonding strength was evaluated based on the actual bonded area on the copper wire surface. Finally, the strength of the thin copper wire/solder joint was summarized using the shear and tensile strengths of the copper/solder interface as well as the tensile strength of the copper wire.

show abstract

Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Cited by 2 publications

References 9 publications

Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Contact Info

Product

Resources

About