2011
DOI: 10.1063/1.3658390
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Interface sharpening in miscible Ni/Cu multilayers studied by atom probe tomography

Abstract: Interfaces of Ni/Cu multilayers were studied by atom probe tomography. To this aim, specimens with sharp or artificially smeared interfaces were prepared and investigated before and after annealing at 773 K. Owing to three-dimensional subnanometer resolution of the atom probe, local chemical analysis of layer interfaces becomes possible without interferences of grain boundaries or geometric roughness. In contrast to the classical expectation for a miscible system, but in agreement with more recent theoretical … Show more

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Cited by 23 publications
(25 citation statements)
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“…This interesting behavior has also been observed in our previous EELS investigation [8]. The compositional oscillation is not expected in the composition profile due to thermally activated diffusion [9][10][11] thus it is a unique behavior induced by deformation. The composition profile across the multilayers for Ni/V after 60 passes that was measured by EELS shows a continuous variation between end members as shown in Fig.…”
Section: Resultssupporting
confidence: 55%
“…This interesting behavior has also been observed in our previous EELS investigation [8]. The compositional oscillation is not expected in the composition profile due to thermally activated diffusion [9][10][11] thus it is a unique behavior induced by deformation. The composition profile across the multilayers for Ni/V after 60 passes that was measured by EELS shows a continuous variation between end members as shown in Fig.…”
Section: Resultssupporting
confidence: 55%
“…36 Atom probe tomography (APT) investigation of sputtered Cu/Ni multilayers also shows a smoothly and monotonically varying composition between the pure elements upon isothermal annealing. 37 The asymmetry in the interdiffusion mobility of the two species was revealed by experimental observations that Ni diffuses into Cu faster than Cu diffuses into Ni causing the complete consumption of pure Cu sooner than pure Ni. 37 The same behavior has also been simulated using the Kinetic Monte Carlo method.…”
Section: Introductionmentioning
confidence: 96%
“…37 The asymmetry in the interdiffusion mobility of the two species was revealed by experimental observations that Ni diffuses into Cu faster than Cu diffuses into Ni causing the complete consumption of pure Cu sooner than pure Ni. 37 The same behavior has also been simulated using the Kinetic Monte Carlo method. 38 The interdiffusion coefficients of Ni in Cu 39 and Cu in Ni 40 have been measured and found to be D NiinCu ¼ 1:95 exp ðÀ236:35=RTÞ cm 2 s À1 ;…”
Section: Introductionmentioning
confidence: 96%
“…5,10 Nowadays, this field remains active and has been extended with the development of atomic simulations and many microscopy techniques like atom probe tomography which give details on the intermixing mechanisms. 11,12 As mentioned, the starting point of the present x-ray diffraction study comes from recent atomistic simulation results obtained for coherent CuNi multilayers. It is found that an unusual layer-by-layer interdiffusion mode should take place in such systems even though Cu and Ni elements are highly miscible.…”
Section: Introductionmentioning
confidence: 99%