Interface cracks in piezoelectric materials

Abstract

Due to their intrinsic electromechanical coupling behavior, piezoelectric materials are widely used in sensors, actuators and other modern technologies. It is well known that piezoelectric ceramics are very brittle and susceptible to fracture. In many cases, fracture occurs at interfaces as debonding and cracks. This leads to an undesired degradation of electrical and mechanical performance. Because of the practical and fundamental importance of the problem, interface cracks in piezoelectric materials have been actively studied in the last few decades. This review provides a comprehensive survey of recent works on cracks situated at the interface of two materials, at least one of which has piezoelectric or piezoelectromagnetic properties. Different electric boundary conditions along the crack faces are discussed. The oscillating and contact zone models for in-plane straight interface cracks between two dissimilar piezoelectric materials or between piezoelectric and non-piezoelectric ones are reviewed. Different peculiarities related to the investigation of interface cracks in piezoelectric materials for the anti-plane case, for functionally graded and thermopiezoelectric materials are presented. Papers related to magnetoelectroelastic bimaterials, to steady state motion of interface cracks in piezoelectric bimaterials and to circular arc-cracks at the interface of piezoelectric materials are reviewed, and various methods used to address these problems are discussed. The review concludes with an outlook on future research directions.

Dynamic intensity factors for multiple permeable cracks in piezoelectric materials

“…Lapusta et al [15,16] considered a crack moving with a subsonic speed along the interface and a limited permeable crack in an adhesive thin interlayer between two semi-infinite piezoelectric spaces. The fracture problems of the interface cracks in PMs have been discussed by Govorukha et al [17] and Loboda et al [18]. The problem of interfacial cracks based on time-domain BEM in PMs was discussed by Lei et al [19].…”

Bond zone model for a conductive crack at the interface of piezoelectric materials under anti‐plane mechanical and in‐plane electric loadings

“…considered an interaction between a conducting interface crack and an electrode. More detailed review of anti‐plane crack problem investigation in piezoelectric bimaterials is presented in Govorukha et al …”

“…[15] Lapusta et al [16] analyzed a crack in a piezoelectric bimaterial with mixed conditions at the crack faces and Onopriienko et al [17] considered an interaction between a conducting interface crack and an electrode. More detailed review of anti-plane crack problem investigation in piezoelectric bimaterials is presented in Govorukha et al [18] Most of the investigations mentioned above are performed in the framework of electrically permeable or impermeable conditions on the crack faces. However, there are less investigations of electrically conducting model for an interface crack in spite of it practical importance.…”

Research on Multiple Griffith Cracks at the Interface of Fine‐Grained Piezoelectric Coating/Substrate

“…Owing to the reliability of composite materials, double-layer bonded bimaterial composite structures have played an important role in smart structures. However, piezoelectric composites tend to crack, fracture, and debond at the interface during the process of fabricating defects and load conditions [1]. erefore, the issue of defects of piezoelectric materials under electromechanical load has attracted wide attention [2][3][4][5][6][7].…”