Interface characterization of a Cu–Ti-coated diamond system

Lin, Bin; Wang, Xitao; Zhang, Yang; Zhu, Jie; Zhang, Hailong

doi:10.1016/j.surfcoat.2015.08.006

Cited by 15 publications

(6 citation statements)

References 23 publications

(28 reference statements)

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“…(1) Alloying elements with strong carbide former [6], (2) diamond surface coating by elements with a strong carbide former [7]. In recent years, numerous studies have conducted on the surface functionalization of diamond, and a great progress has been achieved thus far [8,9]. For instance, Sun et al [8] have reported that B 4 C coating on the diamond particle surface can remarkably increase its tensile strength.…”

Section: Introductionmentioning

confidence: 99%

“…For instance, Sun et al [8] have reported that B 4 C coating on the diamond particle surface can remarkably increase its tensile strength. Lin et al [9] have coated metallic Ti on diamond through a molten-salt approach and deposited Cu composites onto the Ti-coated diamond particles. However, experimental studies on the one-step chemical bonding of Cu to the diamond surface are rare.…”

Section: Introductionmentioning

confidence: 99%

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Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating

Bai

2019

Surface Engineering

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The interface between diamond and copper (Cu) alloy matrix in the composites significantly affects their mechanical properties. The functionalization of the diamond surface is of great potential for exploiting different advanced mechanical tools. In the present case, copperboron-boron carbide (Cu-B-B 4 C) composite coating was grown simultaneously on the whole surface of diamonds. Subsequently, the diamond particles were reinforced with copper-iron (Cu-Fe) matrix composites through powder metallurgy. The microstructural analysis demonstrated that the composite coatings were composed of two layers: the interior layers of B 4 C and B as well as the exterior layer of Cu-B alloy. The bending strength of Cu-B-B 4 C composite-coated diamond was determined to be 701 MPa at a sintering temperature of 800°C, which was nearly 27% higher compared to that (553 MPa) of uncoated diamond/Cu-Fe composites.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating

Bai

2019

Surface Engineering

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“…Sun et al [21] reported that a new reaction product, titanium carbide (TiC), at the interface played an important role in forming a high-strength joint between diamond and a brazing filler metal. Lin et al [22] found that the mechanism behind the carbide's impact on the TC with Cu-Ti-coated diamond particles was produced by a molten salt coating combined with magnetron sputtering. In theory, the two above-mentioned surface modifications for diamond particles can build "bridges" to link diamond particles with the copper matrix together through interfacial bonding.…”

Section: Introductionmentioning

confidence: 99%

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Zhou

et al. 2021

Metals

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The coefficients of thermal expansion (CTE) and thermal conductivity (TC) are important for heat sink applications, as they can minimize stress between heat sink substrates and chips and prevent failure from thermal accumulation in electronics. We investigated the interface behavior and manufacturing of diamond/Cu composites and found that they have much lower TCs than copper due to their low densities. Most defects, such as cavities, form around diamond particles, substantially decreasing the high TC of diamond reinforcements. However, the measurement results for the Cu-coated diamond/Cu composites are unsatisfactory because the nanosized copper layer on the diamond surface grew and spheroidized at elevated sintering temperatures. Realizing ideal interfacial bonding between a copper matrix and diamond particles is difficult. The TC of the 40 vol.% Ti-coated diamond/Cu composite is 475.01 W m−1 K−1, much higher than that of diamond/Cu and Cu-coated diamond/Cu composites under equivalent manufacturing conditions. The minimally grown titanium layer retained its nanosized and was consistent with the sintering temperature. Depositing a nanosized titanium layer on a diamond surface will strengthen interfacial bonding through interface reactions among the copper matrix, nanosized titanium layer and diamond particles, reducing the interfacial thermal resistance and exploiting the high TC of diamond particles, even if defects from powder metallurgy remain. These results provide an important experimental and theoretical basis for manufacturing diamond/Cu composites for heat sink applications.

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“…Dong et al [6] found at 1400 °C, Journal of Physics: Condensed Matter Atomic structures and electronic properties of Ni or N modified Cu/diamond interface the contact angle between the liquid copper and diamond was as high as about 130° while after coating Ti on diamonds, it dropped to 25° between Ti-coated diamonds and copper. Using Auger electron spectroscopy, Zhang et al [9] and Lin et al [10] found that the coated Ti reacted with diamond to form TiC. Other experimental groups [1,[11][12][13][14] found the addition of Cr to copper/diamond composites could also improve the thermal conductivity and mechanical properties of materials by forming chromium carbide.…”

Section: Introductionmentioning

confidence: 99%

Atomic structures and electronic properties of Ni or N modified Cu/diamond interface

Shi

Huang

et al. 2020

J. Phys.: Condens. Matter

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The interfacial stability of copper/diamond directly affects its mechanical properties and thermal conductivity. The atomic structures and electronic properties of Cu/diamond and Cu/X/diamond interfaces have been identified to investigate the effect of interfacial additive X (X = Ni or N) on the low-index interfacial adhesion of copper/diamond composites. For unmodified composites, the interfacial stability decreases in the order of Cu(0 0 1)/diamond(0 0 1) > Cu(1 1 1)/ diamond(1 1 1) > Cu(0 1 1)/diamond(0 1 1). The metallic interfacial additive Ni is found to enhance the Cu(0 1 1)/diamond(0 1 1) interfacial stability and exchange the interfacial stability sequence of (0 1 1) and (1 1 1) composites. The nonmetallic element N will promote the stability of Cu(1 1 1)/diamond(1 1 1) but not alter the stability order of the composites at different interfaces. To explain the origin of interfacial stability, a series of analyses on atomic structures and electronic properties have been carried out, including the identification of the type of formed interfacial boundaries, the measurement of interfacial bond lengths, and the calculations of density of states, bond populations, and atomic charge. The stability of the interface is found to be related to the type of formed interfacial boundary and bond, the interfacial bond populations, and the interfacial bond numbers. The layer-projected density of states reveals that all of the considered interfaces exhibit metal characteristics. The interfacial Ni additive is found to be an electron donor contributing the electrons to its bonded Cu and C atoms while the interfacial N atom is an electron acceptor where it mainly accepts the electrons from its bonded Cu and C.

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Interface characterization of a Cu–Ti-coated diamond system

Cited by 15 publications

References 23 publications

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Atomic structures and electronic properties of Ni or N modified Cu/diamond interface

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Interface characterization of a Cu–Ti-coated diamond system

Cited by 15 publications

References 23 publications

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B4C coating

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B4C coating

The Interface and Fabrication Process of Diamond/Cu Composites with Nanocoated Diamond for Heat Sink Applications

Atomic structures and electronic properties of Ni or N modified Cu/diamond interface

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Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating

Improved flexural strength of diamond/Cu–Fe composites with Cu–B–B₄C coating