Some relationships, fundamental to the resolution of interface wave problems, are presented. These equations allow for the derivation of explicit secular equations for problems involving waves localized near the plane boundary of anisotropic elastic half-spaces, such as Rayleigh, Sholte, or Stoneley waves. They are obtained rapidly, without recourse to the Stroh formalism. As an application, the problems of Stoneley wave propagation and of interface stability for misaligned predeformed incompressible half-spaces are treated. The upper and lower halfspaces are made of the same material, subject to the same prestress, and are rigidly bonded along a common principal plane. The principal axes in this plane do not however coincide, and the wave propagation is studied in the direction of the bisectrix of the angle between a principal axis of the upper half-space and a principal axis of the lower half-space.
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IntroductionWe all know from experience or from intuition that when we press together two large, well-polished, glass plates, they will stick together extremely well; in fact we will have a tough job trying to separate them again because in effect, the two glass panes have become one. A somewhat similar process of "gluing without glue" is used in the microelectronics and optoelectronics industries to bond together semiconductor wafers (Gösele and Tong, 1998). When brought into contact, mirror-polished, flat, clean wafers made of almost any material are attracted via Van der Walls forces and adhere in a rigid and permanent way. This method of direct bonding allows for new and promising designs for insulators, sensors, actuators, nonlinear optics, lightemitting diodes, etc. Solid polymers can also be brought into permanent and rigid contact to manufacture polymer composites. The main traditional technologies of polymer joining are: mechanical fastening (bolts, rivets, fit joints) and: adhesive bonding. Another technology, "fusion bonding", presents great advantages over the previous ones such as, avoidance of high stress concentrations, reduced surface treatment, less inhomogeneities at the interfaces, etc. A recent book by Ageorges and Ye (2002) presents a comprehensive description of fusion bonding, defined as "the joining of two polymer parts by the fusion and consolidation of their interface"; in particular four classes of fusion bonding are listed: "bulk heating (co-consolidation, hot-melt adhesives, dual-resin bonding), frictional heating (spin welding, vibration welding, ultrasonic welding), electromagnetic heating (induction welding, microwave heating, dielectric heating, resistance welding), and two-stage techniques (hot plate welding, hot gas welding, radiant welding)."For semiconductor wafer bonding, the most common and most economical combination is the silicon/silicon wafer bonding. Mozhaev et al. (1998) considered the theoretical implications of misorientation when two identical silicon wafers are rigidly bonded. Specifically they considered, within the framework of anisotropic linear elastici...