Interdiffusion in the Al–Cu System

Abstract

sion couples of pure aluminum and copper metals.In the aluminum-copper equilibrium phase diagram there are five intermediate phases in this temperature range, namelyIt appears that the layer growth of each phase is controlled by the process of volume diffusion since the rate of layer growth obeys the parabolic law. From the temperature dependency of the rate constants of layer growth, the activation energies of the individual phases were obtained.The interdiffusion coefficient for each intermediate phase was calculated by the method introduced by Heumann, andAluminum oxide powder was used for the measurement of the Kirkendall effect. It is clear from this measurement that diffusion in the multilayer system is controlled by the vacancy mechanism and that aluminum diffuses more rapidly than copper.

Effect of thermal aging on interfacial behaviour of copper ball bonds

“…The obtained activation energy was 97.1 kJ/mol, which was slightly different from the reported activation energy, 119.5-140.0 kJ/mol, obtained from the bulk CuiAI diffusion couple [10,11].…”

“…Kim et ale showed that the growth rate of CuiAl IMCs was about 1/10 of that of AuiAI in the temperature range of 150°C -300°C [10]. Cu-AI IMCs formation during thermal aging was reported using a welded diffusion couple of bulky copper and aluminium [9,11] or a thin-film CuiAl diffusion couple [12,13]. According to the binary phase diagram of the Cu-AI system, five IMCs (i.e.…”

Growth Kinetics of β-Ti Solid Solution in Reaction Diffusion

“…The value of 4ðÀ À À Þ 2 for some intermetallic compounds in Al-Cu system was calculated by Funamizu and Watanabe 12) and by Nohara and Hirano 13) for Fe-Mo system. In the present work, the magnitudes of À and À or theTi(Fe), -Ti(Ni) and -Ti(Co) phases have been evaluated from the penetration curve and the interdiffusion coefficient.…”

Effect of Intermetallic Compound Layer on Tensile Strength of Dissimilar Friction-Stir Weld of a High Strength Mg Alloy and Al Alloy

“…In this case, the relationship between the thickness of IMC layer and the diffusion time can be expressed by following equations. 18)…”