Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications

Simon, Winfried; Kulke, R.; Wien, A.; Rittweger, M.; Wolff, I.; Girard, Antoine; Bertinet, Jean-Pierre

doi:10.1109/mwsym.2000.863536

Cited by 20 publications

(3 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…High performance can be achieved while addressing the issues of cost and module size. Various highly intergrable multilayer technologies such as low [3] and high temperature co-fired ceramic (LTCC and HTCC) and MCM-D [4] have been the most suitable technologies for implementing a complete SOP solution. However, organic process technology [5] is currently being studied to achieve complete SOP solutions.…”

Section: Sop Technologymentioning

confidence: 99%

Integrated RF architectures in fully-organic SOP technology

Davis

Sutono

Yoon

et al. 2002

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

Future wireless communications systems require better performance, lower cost, and compact RF front-end footprint. The RF front-end module development and its level of integration are, thus, continuous challenges. In most of the presently used microwave integrated circuit technologies, it is difficult to integrate the passives efficiently with required quality. Another critical obstacle in the design of passive components, which occupy the highest percentage of integrated circuit and circuit board real estate, includes the effort to reduce the module size. These issues can be addressed with multilayer substrate technology. A multilayer organic (MLO)-based process offers the potential as the next generation technology of choice for electronic packaging. It uses a cost effective process, while offering design flexibility and optimized integration due to its multilayer topology. We present the design, model, and measurement data of RF-microwave multilayer transitions and integrated passives implemented in a MLO system on package (SOP) technology. Compact, high inductors, and embedded filter designs for wireless module applications are demonstrated for the first time in this technology.

show abstract

Section: Sop Technologymentioning

confidence: 99%

Integrated RF architectures in fully-organic SOP technology

Davis

Sutono

Yoon

et al. 2002

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

show abstract

“…On-package components not only miniaturize the module, but also minimize or eliminate the need for the discrete components and thereby reduce the assembly time and cost as well. LTCC-based modules demonstrated so far [2]- [4] were dedicated for phase-array applications. The feasibility of implementing a LTCC integrated filter has been demonstrated in [5], [6] for L-band application.…”

mentioning

confidence: 99%

A compact LTCC-based Ku-band transmitter module

Lee

Sutono

Han³

et al. 2002

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

“…Various highly integrable multilayer technologies such as multilayer low-temperature co-fired ceramic (LTCC) [2]- [3] and multilayer organic (MLO)…”

Section: Introductionmentioning

confidence: 99%

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

Davis

Yoon

Mandal

et al.

2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)

View full text Add to dashboard Cite

We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package(S0P) module development. The components developed in this technology include embedded high Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a W A N and satellite communications. Measured inductor Q factor as high as 182 and Self-Resonant-Frequency(SRF) as high as 20GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize passive devices.

show abstract

Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications

Cited by 20 publications

References 1 publication

Integrated RF architectures in fully-organic SOP technology

Integrated RF architectures in fully-organic SOP technology

A compact LTCC-based Ku-band transmitter module

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

Contact Info

Product

Resources

About