2016
DOI: 10.1007/978-3-662-52936-2_5
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Interconnect Materials for IT-SOFCs

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“…For structural components such as electrode supports, they should have a certain strength and thermal shock resistance, easy to process, and the cost is as low as possible. Besides the attention of cell materials, other materials in the cell (stack) also need attention, including the direct interconnection of the series cell (Shao and Tade ´, 2016) and the current collection layer (Shen and Zhang, 2020) and the sealing material (Thomann et al, 2015).…”
Section: Open Accessmentioning
confidence: 99%
“…For structural components such as electrode supports, they should have a certain strength and thermal shock resistance, easy to process, and the cost is as low as possible. Besides the attention of cell materials, other materials in the cell (stack) also need attention, including the direct interconnection of the series cell (Shao and Tade ´, 2016) and the current collection layer (Shen and Zhang, 2020) and the sealing material (Thomann et al, 2015).…”
Section: Open Accessmentioning
confidence: 99%