Interaction of Sn‐Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry

Schmetterer, Clemens; Ganesan, Rajesh; Ipser, Herbert

doi:10.1002/9781119966203.ch4

Cited by 8 publications

(7 citation statements)

References 81 publications

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“…Such a situation can be compared to that observed for conventional soldering. The shear strength of lead free solders, especially within the SAC group, as well as the relation between the intermetallic layer width and the joint shear strength in conventional soldering were the subject of many reports 11, 12. Mostly, these reports show the negative influence of the intermetallic layers formed at the pad/solder interface on the mechanical properties of the joints 13 –.…”

Section: Discussionmentioning

confidence: 99%

Shear strength of Cu/In–48Sn/Cu diffusion soldered interconnections

Wojewoda-Budka

Zięba

2011

Science and Technology of Welding and Joining

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This paper presents the results of shear tests performed on Cu/In-48Sn/Cu diffusion soldered interconnections at the room and elevated temperatures of 373 and 423 K. Before the tests, the microstructure characterisation and chemical microanalysis of the joint area were performed. Termination of the diffusion soldering process led to the significant increase in the ultimate shear strength values. These values differed because of the type of the intermetallic phase that fulfilled the joined area: 11?2 MPa for [Cu6(Sn,In)5] and 28?5 MPa for [Cu41(Sn,In)11] phase. The shear tests performed at higher temperatures revealed a very good strength of the joints (9?8 MPa), especially for those with only the [Cu41(Sn,In)11] phase where fracture occurred inside the copper substrate. In the case of joints where unconsumed solder, [Cu6(Sn,In)5] and/or [Cu41(Sn,In)11], phases were present, the fracture surfaces observations allowed concluding that the crack propagated mostly through the intermetallic/solder interface or inside the intermetallic phase.

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Section: Discussionmentioning

confidence: 99%

Shear strength of Cu/In–48Sn/Cu diffusion soldered interconnections

Wojewoda-Budka

Zięba

2011

Science and Technology of Welding and Joining

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“…The data on vapour pressure of volatile components in these systems are extremely scarce and controversial. On the other hand, in recent years, there have been a large number of publications dedicated to tin phosphides used as negative electrode materials for lithium-ion batteries and for the creation of thermoelectric materials [22][23][24][25][26][27][28][29][30][31][32][33].…”

Section: Phase Equilibria In Systems Based On Elements Of Groups IV A...mentioning

confidence: 99%

The development of methods for the research and synthesis of solid phases by the scientific school of Ya. A Ugai. Review

Semenova

Zavrazhnov

2021

kcmf

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The scientific school founded by Yakov A. Ugai has existed at Voronezh State University for over fifty years. One of its focus areas has been the development of physics and chemistry for obtaining solid phases in systems with volatile components. This determined the necessity to develop methods for the investigation of vapour pressure (tensimetric methods). This article only focuses on some of the works by the VSU staff dedicated to the study and construction of P-T-x diagrams. This review analyses phase equilibria and the nature of the intermediate phases in the AIV – BV, AIV – BV – СV, and AIII – BVI systems.Owing to the special nature of the cation-cation and anion-anion bonds, these compounds have highly specific properties that make them promising materials (2D materials in particular). The article presents an overview of works devoted to the construction of P-T-x diagrams and the investigation of defect formation processes in binary and ternary systems based on AIVBV compounds. It should be emphasised that the known techniques needed updating due to the high values of vapour pressure. This allowed conducting experiments at pressures of about 35-40 atmospheres. The study of the AIII - BVI systems,on the contrary, is complicated by low values of vapour pressure over indium and gallium chalcogenides and the complex composition of the vapour. For such systems the auxiliary component method was developed. The possibilities of its application are wide and are not limited to AIIIBVI compounds. A new method for nonstoichiometry regulation was developed and applied using non-destructive selective chemical transport reactions (i.e. with the participation of an auxiliary component). This method is based on the introduction or removal of one of the sample components by means of a selective chemical transport reaction. In conclusion, the development of methods for the research and synthesis of intermediate phases with variable compositions (properties) was analysed based on the example of the discussed systems.

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“…Sn-based Sn-Ag-Cu alloys with various types of nanosized impurities are interesting materials and promising candidates as low-temperature solders for electronics [1,2]. Early investigations aimed to investigate the microstructure and physico-mechanical properties of Sn-based Sn-Ag-Cu (SAC) alloys as the most promising candidate for the replacement of low-temperature Sn-Pb solders, and they have been actively explored in the modern microelectronic technology [3].…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

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The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

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Interaction of Sn‐Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry

Cited by 8 publications

References 81 publications

Shear strength of Cu/In–48Sn/Cu diffusion soldered interconnections

Shear strength of Cu/In–48Sn/Cu diffusion soldered interconnections

The development of methods for the research and synthesis of solid phases by the scientific school of Ya. A Ugai. Review

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

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