Interaction of precipitate with shear–coupled grain boundary migration

Indentation-induced plastic behaviour of nanotwinned Cu/high entropy alloy FeCoCrNi nanolaminate: an atomic simulation

“…Some previous simulation and theoretical work has studied the grain boundary stability on the mechanical properties of materials introduced solute elements and precipitates. 17,47,48 The stacking fault strengthening is pronounced due to the obvious difference of stacking fault energy between Cu and HEA (see Fig. 2(b)), 29,[49][50][51] where the stacking fault energies of HEA and Cu are 19.4 and 40.8 mJ m À2 .…”