Integration of SAW filters

Abstract

Advances in Micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important properties such as, high acoustic velocities, power durability and temperature stability. Simulation results are presented for different design of SAW filter and different piezoelectric substrates. Index Terms -Micromachining, Monolithic IC, Smart materials, SAW.