Integration of nylon electrospun nanofibers into structural epoxy adhesive joints

Abstract

The fracture toughness is a key parameter in the development of bonded joints for several structural applications. Adhesives are commonly toughened with fillers or modifying the resin chemical composition. Many studies also suggest that resin toughening could be achieved through electrospun polymer nanomat. In previous works, the Authors proved that nylon nanomats can be used as an adhesive carrier and reinforcing web for the adhesive layer. This allowed developing a laboratory route to produce high-quality prepregs of electrospun nylon carrier using medium viscosity, two-component, unfilled epoxy adhesive. By applying the same methodology, in the present work, electrospun nylon prepregs were produced using a high strength and high toughness 2k structural epoxy adhesive to toughen the joint. The wet nano-reinforced strips were placed between S235 steel sandblasted adherents and oven-cured to obtain Double Cantilever Beam (DCB) joints. DCB tests have been performed to compare the mode-I fracture toughness with and without the nanofibrous mat. Unlike previous works with medium-low toughness epoxies, this time the fracture toughness is reduced after the integration of an electrospun nano-reinforcement. From the Scanning Electron Microscope (SEM) images it seems that the nanomat hinders the ductile failure mechanism which instead develops in the neat resin.

Evaluation of XD 10 Polyamide Electrospun Nanofibers to Improve Mode I Fracture Toughness for Epoxy Adhesive Film Bonded Joints

“…The dimensionless parameters λσ and k are reported in Equations ( 2) and (3): [71,72], where a 0 is 25 mm and g is 6 mm.…”