2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2017
DOI: 10.1109/itherm.2017.7992556
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Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics

Sevket U. Yuruker
1
,
Daniel G. Bae
2
,
Raphael Mandel
3
et al.
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