2019
DOI: 10.1038/s41563-019-0335-2
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Integration of bulk materials with two-dimensional materials for physical coupling and applications

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Cited by 227 publications
(189 citation statements)
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“…Efficient integration of 2D-TMDs with designed nanostructures can be expected to represent a crucial step to ultimately harness their optoelectronic properties for scientific and industrial purposes. Significant progress was made in realizing such hybrid systems consisting of nanostructures and 2D-TMDs during the last few years [76,77]. These integration methods generally can be distinguished into dry methods and wet methods.…”
Section: Integration Approachesmentioning
confidence: 99%
“…Efficient integration of 2D-TMDs with designed nanostructures can be expected to represent a crucial step to ultimately harness their optoelectronic properties for scientific and industrial purposes. Significant progress was made in realizing such hybrid systems consisting of nanostructures and 2D-TMDs during the last few years [76,77]. These integration methods generally can be distinguished into dry methods and wet methods.…”
Section: Integration Approachesmentioning
confidence: 99%
“…[16][17] Therefore, there exists an opportunity to combine 2D materials with 3D semiconductors to explore fundamental charge-transport phenomena at their interfaces and exploit them for devices. 18 This approach is particularly appealing since it is easy to transfer 2D vdW layers on 3D surfaces which can in turn help passivate the 3D surface due to the inert chemical nature of the 2D layers, thereby forming an electronically active interface. [7][8] Further, this also opens avenues to vertical integration of more devices on top of a fully fabricated 3D complementary metal-oxide semiconductor (CMOS) platform.…”
Section: Introductionmentioning
confidence: 99%
“…Based on the negligible volume of 2D materials, synaptic operation by tens of femtojoule per spike has been realized widely, which is comparable with the energy consumption per spike in biological synapses . However, the disadvantages of 2D materials have also been revealed: limited synthesis methods for wafer‐scale geometry and the lack of compatibility to CMOS fabrication processes . This progress report will review the 2D materials library and state‐of‐the‐art fabrication methods.…”
Section: Introductionmentioning
confidence: 99%