Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques

Chuang, Jeff; El-Ghazaly, S.M.

doi:10.1109/22.734499

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Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques

Cited by 5 publications

References 16 publications

Monolithic implementation of air-buried microstrip lines for high-density microwave and millimeter wave ICs

Monolithic implementation of air-buried microstrip lines for high-density microwave and millimeter wave ICs

A Multi-Layered Air-Gap Transmission Line Design for CMOS-Compatible Millimeter-Wave ICs

High performance air gap transmission lines for millimeter wave applications

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