Integrated, Transparent Silicon Carbide Electronics and Sensors for Radio Frequency Biomedical Therapy

Abstract

The integration of micro- and nanoelectronics into or onto biomedical devices can facilitate advanced diagnostics and treatments of digestive disorders, cardiovascular diseases, and cancers. Recent developments in gastrointestinal endoscopy and balloon catheter technologies introduce promising paths for minimally invasive surgeries to treat these diseases. However, current therapeutic endoscopy systems fail to meet requirements in multifunctionality, biocompatibility, and safety, particularly when integrated with bioelectronic devices. Here, we report materials, device designs, and assembly schemes for transparent and stable cubic silicon carbide (3C-SiC)-based bioelectronic systems that facilitate tissue ablation, with the capability for integration onto the tips of endoscopes. The excellent optical transparency of SiC-on-glass (SoG) allows for direct observation of areas of interest, with superior electronic functionalities that enable multiple biological sensing and stimulation capabilities to assist in electrical-based ablation procedures. Experimental studies on phantom, vegetable, and animal tissues demonstrated relatively short treatment times and low electric field required for effective lesion removal using our SoG bioelectronic system. In vivo experiments on an animal model were conducted to explore the versatility of SoG electrodes for peripheral nerve stimulation, showing an exciting possibility for the therapy of neural disorders through electrical excitation. The multifunctional features of SoG integrated devices indicate their high potential for minimally invasive, cost-effective, and outcome-enhanced surgical tools, across a wide range of biomedical applications.

Salt‐Triggered Adaptive Dissociation Coating with Dual Effect of Antibacteria and Anti‐Multiple Encrustations in Urological Devices

“…The CS/Si‐N + coating with a thickness of 198 nm has a transparency similar to that of glass (>89.5%), enabling clinicians to observe the visual feedback of the device in real‐time (Figure S5F,G, Supporting Information). [ 24 ]…”

“…The CS/Si-N + coating with a thickness of 198 nm has a transparency similar to that of glass (>89.5%), enabling clinicians to observe the visual feedback of the device in real-time (Figure S5F,G, Supporting Information). [24] Device-associated UTIs caused by bacteria are a serious threat to the health and life of patients. [25] Antibacterial coatings have proven to be an effective strategy for the treatment of antibacterial infections.…”

Recent Progress on Transparent Microelectrode-Based Soft Bioelectronic Devices for Neuroscience and Cardiac Research

“…For example, those transparent microelectrodes will allow for direct electrical sensing/stimulation and visualization of the underneath areas of interest to assist optical diagnostics/therapies or enhance tissue ablation efficiency when integrated on the tip of endoscopes. 144…”

“…Furthermore, integrating soft transparent microelectrodes into or onto existing biomedical devices could potentially facilitate diagnostics and treatments of diseases in clinical practices. For example, those transparent microelectrodes will allow for direct electrical sensing/stimulation and visualization of the underneath areas of interest to assist optical diagnostics/therapies or enhance tissue ablation efficiency when integrated on the tip of endoscopes …”

Engineering Route for Stretchable, 3D Microarchitectures of Wide Bandgap Semiconductors for Biomedical Applications

“…They have emerged as promising candidates to develop multi‐modal biosystems, including neural stimulation electrodes, implanted light‐emitting diodes (LED), and glucose sensors. [ 28 ] Nonetheless, it has been challenging to fabricate flexible devices from WBG materials due to their large Young's modulus, which results in a high bending stiffness in the bulk material form. Recent advancement in the synthesis and growth processes of nanoscale thin film WBG materials and the development of transfer printing processes open exciting opportunities in the fabrication of flexible WBG electronics systems.…”