Integrated Technological Solutions for Zero Waste Recycling of Printed Circuit Boards (PCBs)

Copani, Giacomo; Colledani, Marcello; Brusaferri, Alessandro; Pievatolo, Antonio; Amendola, Eugenio; Avella, Maurizio; Fabrizio, M.

doi:10.1007/978-3-319-94358-9_7

Cited by 9 publications

(7 citation statements)

References 17 publications

(20 reference statements)

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“…Finally, this very book represents a contribution to the dissemination of the whole flagship project. The following chapters will present in details the scientific and industrial results of the 18 research projects (see Tables 1.6 and 1.7) [84][85][86][87][88][89][90][91][92][93][94][95][96][97][98][99][100][101]. Grounding on the experience and results of the flagship project, the final two chapters of this book present an outlook on future manufacturing research by proposing missions aimed at fostering growth and innovation [102] and discussing research infrastructures and funding mechanisms [27].…”

Section: Results Of the Flagship Projectmentioning

confidence: 99%

The Italian Flagship Project: Factories of the Future

Terkaj

Tolio

2019

Factories of the Future

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This chapter deals with the central role of manufacturing in developed and developing countries, assessing how relevant it is from economic and social perspectives. The current international and Italian manufacturing contexts are analysed by highlighting the main criticalities and the impact of relevant global megatrends. Then, the main ongoing industrial research initiatives are presented both at international and Italian level. Based on the elaboration of current context and research initiatives, the Italian Flagship Project Factories of the Future defined five research priorities for the future of the manufacturing industry. Based on these priorities, the flagship project funded a total of 18 small-sized research projects after a competition based on calls for proposals. The results of the funded research projects are analysed in terms of scientific and industrial results, while providing references for more detailed descriptions in the specific chapters. 1.1 The Importance of Manufacturing Industry Manufacturing industry plays a central role in the economy of developed countries for the generation of wealth, jobs and a growing quality of life. Beyond being a sector capable of directly producing wealth and employment, manufacturing industry is a fundamental pillar of the whole economy. In 2016 the value added of manufacturing represented 15.6% and 14.3% of the Gross Domestic Product (GDP) at world and European Union level, respectively. A relevant number of persons are directly

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Section: Results Of the Flagship Projectmentioning

confidence: 99%

The Italian Flagship Project: Factories of the Future

Terkaj

Tolio

2019

Factories of the Future

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“…Several studies have been performed on printed circuit boards, and part of these studies also involved the characterization of the boards. As many recyclers receive a mix of low- and high-grade PCBs, not having a specific composition selection [ 9 ], a data compilation from several authors [ 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 ] and different types of PCBs (computers, smartphones, etc.) have been elaborated ( Table 1 ) in order to obtain a mean value (and a standard deviation) for each metal of the PCBs, thus reaching an average reference value of PCB composition.…”

Section: Methodsmentioning

confidence: 99%

“…In recent years, the mainstream of the recycling approaches of PCBs has focused on chemical process approaches [ 9 ], including co-pyrolysis [ 10 ], hydrometallurgy with nitric acid [ 11 ], and bio-metallurgical processes by biosorption and bioleaching [ 12 ]. These processes are very time-consuming, high energy-demanding, and may release significant pollutants into the atmosphere [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

Gravity and Electrostatic Separation for Recovering Metals from Obsolete Printed Circuit Board

Oliveira

Tori²,

Zanetti

et al. 2022

Materials

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This study proposed an evaluation of enrichment processes of obsolete Printed Circuit Boards (PCBs), by means of gravity and electrostatic separation, aiming at the recovery of metals. PCBs are the most important component in electronic devices, having high concentrations of metals and offering a secondary source of raw materials. Its recycling promotes the reduction in the environmental impacts associated with its production, use, and disposal. The recovery method studied started with the dismantling of the PCB, followed by a comminution and granulometric classification. Subsequent magnetic, gravity, and electrostatic separations were performed. After the separations, a macroscopic visual evaluation and chemical analysis were carried out, determining the metal content in the concentrate products. The results obtained from gravity separation showed a product with metallic concentrations of 89% and 76% for particle sizes of 0.3–0.6 mm and 0.6–1.18 mm, respectively. In electrostatic separation, the product obtained was 88% for the lower particle size (<0.3 mm) and 62% for particles sizes >1.18 mm.

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“…75 along with the PCB supply chain vulnerabilities. As the automated recycling of PCBs, [76][77][78] especially critical infrastructure such as medical components, 79 this presents an unprecedented opportunity for recycled PCBs and ICs to return to market or fall vulnerable to reverse engineering. 80…”

Section: Printed Circuit Boardmentioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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Terahertz radiation for inspection and fault detection has been of interest for the semiconductor industry since the first generation and detection of THz signals. Until recent hardware advances, THz systems lacked the signal quality and reliability for use as an effective nondestructive testing (NDT) method. Incremental advances in THz sources, detectors, and signal processing resulted in the successful applied-industrial use of THz NDT techniques on carbon fiber laminates, automotive coatings, and for detection of counterfeit pharmaceutical tablets. Semiconductor inspection and verification methods ensure the functionality and thereby safety of vital electronics for several critical industries. For this reason, the reliability and verification of a THz NDT method must exceed currently used inspection systems. With recent laboratory access to THz radiation, THz inspection methods are often compared with existing optical, electrical, and volumetric semiconductor verification techniques for their production monitoring and failure analysis viability. This review will cover THz techniques and their applications at the printed circuit board (PCB), integrated circuit (IC), and transistor/gate scales. The THz radiation gap spans between optical and electronic ranges with a millimeter-sized wavelength allowing for adequate penetration of plastic and ceramic and semiconductor materials. THz radiation can be used to determine structural features, electrical signatures in the THz range, and chemical information simultaneously. Cost and environmental limitations restricted the ability for THz NDT semiconductor inspection methods to escape the lab and succeed in the dynamic environment of a semiconductor fabrication environment. Hybridized metrology methods incorporating information from multiple inspection tools are a regime where THz spectral and structural data can be combined with existing methods such as optical, x-ray, or E-beam. THz can be used initially to offer support to the complex failure analysis and verification requirements of the semiconductor industry from nanoscale to macroscale features and components. For THz systems to become independent inspection tools used for semiconductor production monitoring, in the lab or fab, this will require a confident level of statistical process control for THz signal generation, detection, or processing. Applied industrial semiconductor device inspection will likely be a result of a combination of research into THz hardware, reconstruction techniques, and the widespread application of machine learning techniques. Many breakthroughs occurred over the years to enable successful nondestructive characterization and inspection of semiconductor devices from the nanoscale transistors to fully packaged integrated circuits and assembled PCBs.

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Integrated Technological Solutions for Zero Waste Recycling of Printed Circuit Boards (PCBs)

Cited by 9 publications

References 17 publications

The Italian Flagship Project: Factories of the Future

The Italian Flagship Project: Factories of the Future

Gravity and Electrostatic Separation for Recovering Metals from Obsolete Printed Circuit Board

Review of THz-based semiconductor assurance

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