2007 IEEE Antennas and Propagation Society International Symposium 2007
DOI: 10.1109/aps.2007.4395849
|View full text |Cite
|
Sign up to set email alerts
|

Integrated RF circuits design and packaging in high contrast ceramic-polymer composites

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2008
2008
2011
2011

Publication Types

Select...
2

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 4 publications
0
1
0
Order By: Relevance
“…As we can only print 1µm-thick metal layer on the polymer surface using our current evaporation set-up [10], an approach to increase the metal layer thickness is to employ electroplating/electro-deposition. To further increase the bonding and adhesion between the metal layer and the polymer surface, the latter is textured with a periodic array of pyramidal (reflector-like) depression (Fig.…”
Section: Electro-deposition On Microtextured Surfacesmentioning
confidence: 99%
“…As we can only print 1µm-thick metal layer on the polymer surface using our current evaporation set-up [10], an approach to increase the metal layer thickness is to employ electroplating/electro-deposition. To further increase the bonding and adhesion between the metal layer and the polymer surface, the latter is textured with a periodic array of pyramidal (reflector-like) depression (Fig.…”
Section: Electro-deposition On Microtextured Surfacesmentioning
confidence: 99%