Integrated phased‐array switches for large‐scale photonic routing on chip

Soğancı, İbrahim Murat; Tanemura, Takuo; Nakano, Yoshiaki

doi:10.1002/lpor.201100015

Cited by 19 publications

(2 citation statements)

References 41 publications

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“…Over the years, many approaches have been proposed for realizing optical switches [139,150], such as electro-optic (mainly in Ti:LiNbO 3 ) [151][152][153][154][155], acousto-optic [156][157][158], thermooptic [159][160][161][162][163], liquid crystals [164][165][166][167], microelectromechanical systems (MEMS) [168][169][170][171][172][173] and semiconductor optical amplifiers [174][175][176][177][178][179]. These devices require expensive equipment and could be replaced by Si photonics integrated circuits to comply with the requirements of miniaturization and cost-effectiveness [180], through mass manufacturability [181].…”

Section: Graphene-based Switchingmentioning

confidence: 99%

Graphene-based integrated photonics for next-generation datacom and telecom

Romagnoli¹,

Sorianello²,

et al. 2018

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Graphene is an ideal material for optoelectronic applications. Its photonic properties give several advantages and complementarities over Si photonics. For example, graphene enables both electro-absorption and electro-refraction modulation with an electro-optical index change exceeding 10 −3 . It can be used for optical add-drop multiplexing with voltage control, eliminating the current dissipation used for the thermal detuning of microresonators, and for thermoelectric-based ultrafast optical detectors that generate a voltage without transimpedance amplifiers. Here, we present our vision for graphene-based integrated photonics. We review graphene-based transceivers and compare them with existing technologies. Strategies for improving power consumption, manufacturability and wafer-scale integration are addressed. We outline a roadmap of the technological requirements to meet the demands of the datacom and telecom markets. We show that graphene based integrated photonics could enable ultrahigh spatial bandwidth density , low power consumption for board connectivity and connectivity between data centres, access networks and metropolitan, core, regional and long-haul optical communications.Photonics is poised to play an increasingly important role in ICT ( Fig. 1a), since the fixed high capacity links are largely based on photonic technologies. Photonic devices need to support ultra-large bandwidth operation, for example, 200 Tb s−1 in a single fibre[9] and >10 Tb s −1 cm −2 in integrated Si photonics chips [10]. To achieve this, the key components of Si photonics, photodetectors and modulators, need very high performances in terms of speed (≥25 Gb s −1 ), footprint (<1 mm 2 ), insertion loss (<4 dB), manufacturability (>10 6 pieces per year) and power consumption (<1 pJ bit −1 ). To date, these requirements have not been fulfilled in one system [11]. Furthermore, in terms of production volumes, photonics is not yet comparable to microelectronics [12], even if the increase in demand for optical networks would, by 2021, lead to an average global Internet Protocol (IP) traffic of 3.3 ZB (zettabytes), corresponding to an average usage data rate of ~800 Tb s −1 (refs[13,14]). In the context of the IoT[7], other applications, including infrared (IR) sensors, biosensors, environmental sensors, metrology, quantum communications and machine vision, will require even larger production volumes [13,15].The telecom network can be divided into three segments: access, aggregation and core (Fig. 1a). The access network is the interface between subscribers and the immediate service provider. The aggregation network aggregates all the input data streams from tributary access networks, converging towards the higher-level core network. The aggregation network includes local and metropolitan networks, which then converge to regional networks. A local area network (LAN) interconnects computers within a limited area, such as a residence, school, laboratory, university or office building. A metropolitan area network (MAN) interconnects us...

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Section: Graphene-based Switchingmentioning

confidence: 99%

Graphene-based integrated photonics for next-generation datacom and telecom

Romagnoli¹,

Sorianello²,

et al. 2018

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“…Splitters and combiners have enabled up to 16 connections. Work on one-to-many switches has led to the demonstration of 1 Â 16 connectivity for broadband phase array switches 38 and 1 Â 100 connectivity for an integrated two-stage circuit comprising a combination of phase arrays and SOA gates 39 . N Â N switch matrices require shuffle networks with waveguide crossings and the additional associated optical wiring complexity.…”

Section: Monolithic Optical Switch Architecturesmentioning

confidence: 99%

Integrated optical switch matrices for packet data networks

Stabile

Albores-Mejia

Rohit³

et al. 2016

Microsyst Nanoeng

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Integrated circuit technologies are enabling intelligent, chip-based, optical packet switch matrices. Rapid real-time reconfigurability at the photonic layer using integrated circuit technologies is expected to enable cost-effective, energy-efficient, and transparent data communications. InP integrated photonic circuits offer high-performance amplifiers, switches, modulators, detectors, and de/multiplexers in the same wafer-scale processes. The complexity of these circuits has been transformed as the process technologies have matured, enabling component counts to increase to many hundreds per chip. Active-passive monolithic integration has enabled switching matrices with up to 480 components, connecting 16 inputs to 16 outputs. Integrated switching matrices route data streams of hundreds of gigabits per second. Multi-path and packet time-scale switching have been demonstrated in the laboratory to route between multiple fibre connections. Wavelength-granularity routing and monitoring is realised inside the chip. In this paper, we review the current status in InP integrated photonics for optical switch matrices, paying particular attention to the additional on-chip functions that become feasible with active component integration. We highlight the opportunities for introducing intelligence at the physical layer and explore the requirements and opportunities for cost-effective, scalable switching.Keywords: large-scale integration; optical switching devices; optoelectronics; photonic integrated circuits In turn, this is leading to unsustainable energy usage and an increasing complexity in network control 2-4 . Optical packet routing and switching technologies offer the prospect of highly efficient networking that is attuned to packet-based traffic flows 4 . However, to date the underlying photonic hardware has not proved sufficiently scalable, and the physical layer performance has been impeded by the analogue nature of the underlying photonic components.Photonic switch matrices and wavelength-selective switches already provide energy-efficient connectivity at the highest bandwidths for circuit-provisioned time-scales. The optical switching engines that are now being deployed in telecom networks and data centre networks are based on slow (millisecond) circuitswitching technologies that leverage micro-electro-mechanical systems (MEMS) 5,6 and liquid crystal on silicon 7,8 switch elements. 3D MEMS systems now allow for connectivity between many hundreds of fibre connections 9,10 . The combination of broadband photonic switches and wavelength-selective diffractive optical elements offers even higher connectivity. However, the use of surface normal micro-optics introduces considerable assembly complexity as the connectivity scales. The switching speeds do not support packet-based traffic at the optical layer.Planar photonic integrated circuits have long held the promise of high-speed broadband connectivity with mass-manufactureable microchips 11 , but only recently has the technology

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Trends in High Speed Interconnects: InP Monolithic Integration

Williams

Docter

2017

Optical Switching in Next Generation Data Centers

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Integrated phased‐array switches for large‐scale photonic routing on chip

Cited by 19 publications

References 41 publications

Graphene-based integrated photonics for next-generation datacom and telecom

Graphene-based integrated photonics for next-generation datacom and telecom

Integrated optical switch matrices for packet data networks

Trends in High Speed Interconnects: InP Monolithic Integration

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