Integrated Mechanical, Thermal, Data, and Power Transfer Interfaces for Future Space Robotics

Abstract

In-situ connectability among modules of a space system can provide significantly enhanced flexibility, adaptability, and robustness for space exploration and servicing missions. Connection of modules in extra-terrestrial environment is hence a topic of rising importance in modern orbital or planetary missions. As an example, the increasing number of satellites sent to space have introduced a large set of connections of various type, for transferring mechanical loads, data, electrical power and heat from one module to another. This paper provides a comprehensive review of published work in space robotic connections and presents the different transfer types developed and used to date in robotic applications for orbital and extra-terrestrial planetary missions. The aims of this paper are to present a detailed analysis of the state of the art available technologies, to make an analysis of and comparison among different solutions to common problems, to synthesize and identify future connectability research, and to lay the foundation for future European space robotic connectability effort and work for a complex and growing important future space missions. All types are described in their base characteristics and evaluated for orbital and planetary environments. This analysis shows that despite the large number of connectors developed for each of the four functionalities (mechanical, thermal, data, and electrical power) here considered, the trend is that researchers are integrating more than one functionalizes into a single equipment or device, to reduce costs and improve standardization. The outcomes of this literature review have contributed toward the design of a future multifunctional, standard and scalable interface at the early stage of the Standard Interface for Robotic Manipulation of Payloads in Future Space Missions (SIROM) project, a European Commission funded Horizon 2020 project. SIROM interfaces will be employed by European prime contractors in future extra-terrestrial missions.

A review on the interfaces of orbital replacement unit: Great efforts for modular spacecraft

“…Moreover, further exploration is required for new methods to develop mechanical, power, data, thermal, and fluid transmission interfaces. Yan 95 has discussed the thermal, data, and power transmission methods used in aerospace facilities. For replaceable aerospace components such as the ORUs, the most important concern is to improve the transmission efficiency and reliability of docking interfaces.…”

“…Figure 29. Typical orbital replacement unit power and data transmission interfaces of (a) pin-type, (b) tab-type, (c) contact chip-type and (d) wireless-type 20,31,92,95. …”

Multi-Functional Interface for Flexibility and Reconfigurability of Future European Space Robotic Systems

“…In addition to the above industrial view, the literature reviews conducted in previous SIROM papers drew up an overview [3] of power, data, thermal and mechanical functionalities in interfaces already used in robotics and space applications. A few devices integrating more than one of these functionalities are also presented in [4].…”

Research on Integrated Interface Design of Small Modular Spacecraf

“…These requirements force the interface to be designed as a standardized, extensible, modular universal connection interface with multiple functions (mechanical, electrical, data, and thermal). This kind of interface can satisfy the multi-functional coupling among spacecraft modules, platforms, payloads, client servers and robot end effectors in orbit and planetary environments [7]. At present, the large-scale docking mechanisms used in manned spaceflight mainly include Probe-drogue Mechanism, APAS-75, APAS-89, Hybrid Docking Mechanisms, and Common Berthing Mechanism, etc.…”